Inventor · disambiguated record
Elke Zakel
Also filed as: ZAKEL ELKE
45 granted patents·5 pending applications·919 citations·filing 1989–2011
98Inventor score
Files withFRAUNHOFER GES FORSCHUNG16PAC TECH GMBH10ZAKEL ELKE10PAC TEC PACKAGING TECHNOLOGIES3PAC TECH & MDASH PACKAGING TECHNOLOGIES GMBH2
Top patents by PatentIndex Score
50 records- 0197US6281577B1Chips arranged in plurality of planes and electrically connected to one anotherPAC TECH GMBH·Filed 1997·Granted Aug 28, 2001·350 cites·7 claims
- 0287US5906312ASolder bump for flip chip assembly and method of its fabricationFRANUNHOFER GES ZUR FOERDE RUN·Filed 1995·Granted May 25, 1999·64 cites·14 claims
- 0385US7882997B2Method and device for mutual contacting of two wafersPAC TECH GMBH·Filed 2005·Granted Feb 8, 2011·13 cites·20 claims
- 0482US6153940ACore metal soldering knob flip-chip technologyFRAUNHOFER GES FORSCHUNG·Filed 1995·Granted Nov 28, 2000·84 cites·38 claims
- 0578US6478906B1Method for bonding a flexible substrate to a chipFRAUNHOFER GES FORSCHUNG·Filed 2000·Granted Nov 12, 2002·27 cites·2 claims
- 0676US9401298B2Method and device for transferring a chip to a contact substrateZAKEL ELKE·Filed 2006·Granted Jul 26, 2016·7 cites·10 claims
- 0775US6651891B1Method for producing contactless chip cards and corresponding contactless chip cardZAKEL ELKE·Filed 1997·Granted Nov 25, 2003·56 cites·22 claims
- 0871US8361881B2Method for alternately contacting two wafersPAC TECH GMBH·Filed 2011·Granted Jan 29, 2013·3 cites·6 claims
- 0971US6070788AMethod of soldering terminal faces, as well as a method of manufacturing a solder alloyFRAUNHOFER GES FORSCHUNG·Filed 1995·Granted Jun 6, 2000·31 cites·16 claims
- 1068US6277660B1Method and apparatus for testing chipsFRAUNHOFER GES FORSCHUNG·Filed 2000·Granted Aug 21, 2001·12 cites·10 claims
- 1165US7121449B2Method and device for applying material to a workpiecePAC TEC PACKAGING TECHNOLOGIES·Filed 2001·Granted Oct 17, 2006·13 cites·17 claims
- 1265US7087442B2Process for the formation of a spatial chip arrangement and spatial chip arrangementPAC TECH GMBH·Filed 2001·Granted Aug 8, 2006·11 cites·6 claims
- 1363US7829817B2Device for removing solder material from a soldered jointPAC TECH GMBH·Filed 2001·Granted Nov 9, 2010·11 cites·5 claims
- 1462US5989993AMethod for galvanic forming of bonding padsZAKEL ELKE·Filed 1996·Granted Nov 23, 1999·30 cites·14 claims
- 1558US7762446B2Method and device for transferring a solder deposit configurationPAC TECH & MDASH PACKAGING TEC·Filed 2005·Granted Jul 27, 2010·2 cites·3 claims
- 1658US6955284B2Device for positioning a tool in relation to a workpiecePAC TEC PACKAGING TECHNOLOGIES·Filed 2001·Granted Oct 18, 2005·7 cites·8 claims
- 1758US6915940B2Device for applying solder globulesPAC TECH GMBH·Filed 2002·Granted Jul 12, 2005·6 cites·5 claims
- 1857US7007834B2Contact bump construction for the production of a connector construction for substrate connecting surfacesPAC TECH GMBH·Filed 2001·Granted Mar 7, 2006·7 cites·7 claims
- 1955US7021517B2Method and device for applying pieces of material to a workpiecePAC TEC PACKAGING TECHNOLOGIES·Filed 2001·Granted Apr 4, 2006·8 cites·19 claims
- 2055US6955943B2Method for producing a substrate arrangementPAC TECH GMBH·Filed 2002·Granted Oct 18, 2005·6 cites·16 claims
- 2153US6043985AThermal connecting structure for connecting materials with different expansion coefficientsFRAUNHOFER GES FORSCHUNG·Filed 1997·Granted Mar 28, 2000·21 cites·7 claims
- 2253US5928458AFlip chip bonding with non conductive adhesiveFRAUNHOFER GES FORSCHUNG·Filed 1995·Granted Jul 27, 1999·21 cites·7 claims
- 2352US6285562B1Method of contacting a chipFRAUNHOFER GES FORSCHUNG·Filed 1995·Granted Sep 4, 2001·19 cites·13 claims
- 2452US6093971AChip module with conductor paths on the chip bonding side of a chip carrierFRAUNHOFER GES FORSCHUNG·Filed 1997·Granted Jul 25, 2000·18 cites·11 claims
- 2550US8256131B2Method and device for drying circuit substratesZAKEL ELKE·Filed 2004·Granted Sep 4, 2012·2 cites·18 claims
- 2650US7926699B2Method and device for transferring a solder deposit configurationPAC TECH & MDASH PACKAGING TECHNOLOGIES GMBH·Filed 2009·Granted Apr 19, 2011·0 cites·7 claims
- 2749US6407457B1Contact-bumpless chip contacting method and an electronic circuit produced by said methodSMART PAC GMBH TECHNOLOGY SERV·Filed 2000·Granted Jun 18, 2002·4 cites·9 claims
- 2848US6211571B1Method and apparatus for testing chipsFRAUNHOFER GES FORSCHUNG·Filed 1996·Granted Apr 3, 2001·12 cites·11 claims
- 2948US2012126410A1Contact Array for Substrate ContactingZAKEL ELKE·Filed 2009·Application pending·0 cites
- 3046US6720257B1Bump with basic metallization and method for manufacturing the basic metallizationPAC TECH GMBH·Filed 2000·Granted Apr 13, 2004·2 cites·19 claims
- 3146US5785234AMethod of surface-contacting electronic componentsFRAUNHOFER GES FORSCHUNG·Filed 1996·Granted Jul 28, 1998·13 cites·20 claims
- 3243US8497578B2Terminal face contact structure and method of making sameZAKEL ELKE·Filed 2009·Granted Jul 30, 2013·0 cites·17 claims
- 3343US7481352B2Method for ablating points of contact (debumping)PAC TECH GMBH·Filed 2001·Granted Jan 27, 2009·2 cites·26 claims
- 3442US6107118AChip-contacting method requiring no contact bumps, and electronic circuit produced in this wayZAKEL ELKE·Filed 1996·Granted Aug 22, 2000·11 cites·9 claims
- 3542US2008260370A1Optical SystemZAKEL ELKE·Filed 2004·Application pending·0 cites
- 3640US7932611B2Device for alternately contacting two wafersPAC TECH & MDASH PACKAGING TECHNOLOGIES GMBH·Filed 2004·Granted Apr 26, 2011·1 cites·6 claims
- 3738US7049213B2Method for producing a contact substrate and corresponding contact substrateSMART PAC GMBH TECHNOLOGY SERV·Filed 2002·Granted May 23, 2006·0 cites·19 claims
- 3838US5976302AMethod of joining electronic components to a substrateFRAUNHOFER GES FORSCHUNG·Filed 1995·Granted Nov 2, 1999·10 cites·7 claims
- 3937US8742571B2Diode array and method for producing a diode arrayZAKEL ELKE·Filed 2010·Granted Jun 3, 2014·0 cites·10 claims
- 4037US6160218AChip housingFRAUNHOFER GES FORSCHUNG·Filed 1996·Granted Dec 12, 2000·7 cites·6 claims
- 4136US5833128AFlux-free contacting of componentsFRAUNHOFER GES FORSCHUNG·Filed 1996·Granted Nov 10, 1998·10 cites·5 claims
- 4235US8431477B2Method for joining aligned discrete optical elementsBECKERT ERIK·Filed 2008·Granted Apr 30, 2013·0 cites·25 claims
- 4334US6284639B1Method for forming a structured metallization on a semiconductor waferFRAUNHOFER GES FORSCHUNG·Filed 1999·Granted Sep 4, 2001·5 cites·15 claims
- 4434US5956232AChip support arrangement and chip support for the manufacture of a chip casingFRAUNHOFER GES FORSCHUNG·Filed 1995·Granted Sep 21, 1999·6 cites·11 claims
- 4534US4973389AProcess for making a high temperature-resistant metal layer on a ceramic surfaceSCHERING AG·Filed 1989·Granted Nov 27, 1990·3 cites·9 claims
- 4632US2004135265A1Contacting microchips by means of pressureZAKEL ELKE·Filed 2002·Application pending·0 cites
- 4731US2004065358A1Treatment device for wafersFiled 2001·Application pending·0 cites
- 4828US5845838AProcess for remelting a contact surface metallizationFRAUNHOFER GES FORSCHUNG·Filed 1995·Granted Dec 8, 1998·2 cites·7 claims
- 4926US6012625AProcess and device for forming raised metallised contactsFRAUNHOFER GES ZUR FORDERUNGDE·Filed 1996·Granted Jan 11, 2000·2 cites·5 claims
- 5024US2002047217A1Metallic undercoating for solder materialsFiled 1999·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →