Inventor · disambiguated record
Elley Zhang
Also filed as: ZHANG ELLEY
3 granted patents·2 citations·filing 2021–2022
49Inventor score
Top patents by PatentIndex Score
3 records- 0188US11942459B2Semiconductor device package with exposed bond wiresWESTERN DIGITAL TECH INC·Filed 2022·Granted Mar 26, 2024·2 cites·20 claims
- 0248US12482761B2Semiconductor device package having improved conductive stub coverageSANDISK TECHNOLOGIES INC·Filed 2021·Granted Nov 25, 2025·0 cites·20 claims
- 0337US12341130B2Method of thinning a semiconductor dieWESTERN DIGITAL TECH INC·Filed 2022·Granted Jun 24, 2025·0 cites·10 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →