Inventor · disambiguated record
Emile Davies-Venn
Also filed as: DAVIES-VENN EMILE
7 granted patents·44 citations·filing 2007–2019
82Inventor score
Top patents by PatentIndex Score
7 records- 0191US7626472B2Package embedded three dimensional balunINTEL CORP·Filed 2007·Granted Dec 1, 2009·28 cites·14 claims
- 0285US10510667B2Conductive coating for a microelectronics packageINTEL CORP·Filed 2016·Granted Dec 17, 2019·4 cites·20 claims
- 0379US9520350B2Bumpless build-up layer (BBUL) semiconductor package with ultra-thin dielectric layerTEH WENG HONG·Filed 2013·Granted Dec 13, 2016·5 cites·15 claims
- 0473US10910314B2Conductive coating for a microelectronics packageINTEL CORP·Filed 2019·Granted Feb 2, 2021·1 cites·20 claims
- 0572US8804366B2Package-based filtering and matching solutionsKAMGAING TELESPHOR·Filed 2011·Granted Aug 12, 2014·3 cites·5 claims
- 0667US8111521B2Package-based filtering and matching solutionsKAMGAING TELESPHOR·Filed 2007·Granted Feb 7, 2012·3 cites·9 claims
- 0739US11295998B2Stiffener and package substrate for a semiconductor packageINTEL CORP·Filed 2018·Granted Apr 5, 2022·0 cites·29 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →