Inventor · disambiguated record
Emil Lamco Jocson
Also filed as: JOCSON EMIL LAMCO
1 granted patent·1 pending application·0 citations·filing 2020–2024
7Inventor score
Technology areasH10W
Files withINFINEON TECHNOLOGIES AG2
Top patents by PatentIndex Score
2 records- 0147US2025286012A1Semiconductor package having a ball-bond interconnect structure and related methods of manufacturingINFINEON TECHNOLOGIES AG·Filed 2024·Application pending·0 cites
- 0239US11705387B2Multi-layer interconnection ribbonINFINEON TECHNOLOGIES AG·Filed 2020·Granted Jul 18, 2023·0 cites·17 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →