Inventor · disambiguated record
Emi Sawayama
Also filed as: SAWAYAMA EMI
1 granted patent·3 pending applications·1 citations·filing 2009–2011
16Inventor score
Technology areasH10W
Top patents by PatentIndex Score
4 records- 0154US8110907B2Semiconductor device including first substrate having plurality of wires and a plurality of first electrodes and a second substrate including a semiconductor chip being mounted thereon, and second electrodes connected with first electrodes of first substrateYAMAGUCHI MASAHIRO·Filed 2009·Granted Feb 7, 2012·1 cites·19 claims
- 0243US2010038767A1Semiconductor device and method of manufacturing the sameELPIDA MEMORY INC·Filed 2009·Application pending·0 cites
- 0343US2010052133A1Stack type semiconductor device with reinforcing resinELPIDA MEMORY INC·Filed 2009·Application pending·0 cites
- 0427US2012049354A1Semiconductor device and method of forming the sameSAWAYAMA EMI·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →