Inventor · disambiguated record
Enbin Jo
Also filed as: JO ENBIN
0 granted patents·6 pending applications·0 citations·filing 2023–2024
Technology areasH10W
Files withSAMSUNG ELECTRONICS CO LTD6
Top patents by PatentIndex Score
6 records- 0163US2025183169A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0263US2025183206A1Semiconductor chip and semiconductor package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0359US2024258278A1Semiconductor package including stacked semiconductor chipsSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 0458US2024234349A9Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 0557US2024096831A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 0656US2024072006A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →