Inventor · disambiguated record
Enyong Tai
Also filed as: TAI ENYONG
5 granted patents·1 pending application·14 citations·filing 2011–2024
72Inventor score
Top patents by PatentIndex Score
6 records- 0196US11309281B2Overlapping die stacks for NAND package architectureMICRON TECHNOLOGY INC·Filed 2020·Granted Apr 19, 2022·5 cites·19 claims
- 0283US9773766B2Semiconductor device including independent film layer for embedding and/or spacing semiconductor dieSANDISK SEMICONDUCTOR (SHANGHAI) CO LTD·Filed 2013·Granted Sep 26, 2017·8 cites·20 claims
- 0380US12444709B2Overlapping die stacks for NAND package architectureMICRON TECHNOLOGY INC·Filed 2024·Granted Oct 14, 2025·0 cites·17 claims
- 0473US11908833B2Overlapping die stacks for nand package architectureMICRON TECHNOLOGY INC·Filed 2022·Granted Feb 20, 2024·0 cites·20 claims
- 0552US9038264B2Non-uniform vacuum profile die attach tipRAI PRADEEP KUMAR·Filed 2011·Granted May 26, 2015·1 cites·5 claims
- 0641US2015187745A1Solder pillars for embedding semiconductor dieSANDISK SEMICONDUCTOR SHANGHAI CO LTD·Filed 2014·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →