Inventor · disambiguated record
Enis Tuncer
Also filed as: TUNCER ENIS
37 granted patents·19 pending applications·104 citations·filing 2009–2024
95Inventor score
Files withTEXAS INSTRUMENTS INC46TUNCER ENIS5GE OIL & GAS ESP INC2GEN ELECTRIC1LIST III FREDERICK ALYIOUS1
Top patents by PatentIndex Score
56 records- 0197US11614482B1Method for manufacturing semiconductor device package with isolationTEXAS INSTRUMENTS INC·Filed 2021·Granted Mar 28, 2023·5 cites·20 claims
- 0297US8331076B2Clad fiber capacitor and method of making sameTUNCER ENIS·Filed 2010·Granted Dec 11, 2012·78 cites·7 claims
- 0395US11538738B1Isolated temperature sensor deviceTEXAS INSTRUMENTS INC·Filed 2021·Granted Dec 27, 2022·3 cites·21 claims
- 0494US11621215B1Semiconductor device package with isolated semiconductor die and electric field curtailmentTEXAS INSTRUMENTS INC·Filed 2021·Granted Apr 4, 2023·2 cites·21 claims
- 0592US12266595B2Semiconductor device package with isolated semiconductor die and electric field curtailmentTEXAS INSTRUMENTS INC·Filed 2023·Granted Apr 1, 2025·1 cites·15 claims
- 0690US10770378B1Isolated component designTEXAS INSTRUMENTS INC·Filed 2019·Granted Sep 8, 2020·6 cites·20 claims
- 0784US11728289B2Integrated magnetic assembly with conductive field platesTEXAS INSTRUMENTS INC·Filed 2021·Granted Aug 15, 2023·1 cites·20 claims
- 0884US11658101B2Isolated temperature sensor device packageTEXAS INSTRUMENTS INC·Filed 2021·Granted May 23, 2023·1 cites·22 claims
- 0982US11342251B2Isolated component designTEXAS INSTRUMENTS INC·Filed 2020·Granted May 24, 2022·1 cites·19 claims
- 1081US11322433B2Hall sensor packagesTEXAS INSTRUMENTS INC·Filed 2020·Granted May 3, 2022·2 cites·22 claims
- 1177US10892405B2Hall-effect sensor package with added current pathTEXAS INSTRUMENTS INC·Filed 2019·Granted Jan 12, 2021·2 cites·21 claims
- 1276US2025111987A1Integrated high voltage electronic device with high relative permittivity layersTEXAS INSTRUMENTS INC·Filed 2024·Application pending·0 cites
- 1375US12183693B2Integrated magnetic assembly with conductive field platesTEXAS INSTRUMENTS INC·Filed 2023·Granted Dec 31, 2024·0 cites·28 claims
- 1472US8315032B2High power density capacitor and method of fabricationTUNCER ENIS·Filed 2010·Granted Nov 20, 2012·2 cites·9 claims
- 1570US11557722B2Hall-effect sensor package with added current pathTEXAS INSTRUMENTS INC·Filed 2021·Granted Jan 17, 2023·0 cites·20 claims
- 1669US2023298979A1Isolated temperature sensor device packageTEXAS INSTRUMENTS INC·Filed 2023·Application pending·0 cites
- 1766US11881445B2High voltage semiconductor device lead frame and method of fabricationTEXAS INSTRUMENTS INC·Filed 2021·Granted Jan 23, 2024·0 cites·20 claims
- 1866US11598742B2Semiconductor device for sensing impedance changes in a mediumTEXAS INSTRUMENTS INC·Filed 2020·Granted Mar 7, 2023·0 cites·19 claims
- 1966US11573203B2Humidity sensorTEXAS INSTRUMENTS INC·Filed 2020·Granted Feb 7, 2023·0 cites·34 claims
- 2065US12170164B2Integrated high voltage electronic device with high relative permittivity layersTEXAS INSTRUMENTS INC·Filed 2021·Granted Dec 17, 2024·0 cites·17 claims
- 2165US11935844B2Semiconductor device and method of the sameTEXAS INSTRUMENTS INC·Filed 2020·Granted Mar 19, 2024·0 cites·29 claims
- 2263US2022108896A1Testing semiconductor componentsTEXAS INSTRUMENTS INC·Filed 2021·Application pending·0 cites
- 2361US11201065B2Testing semiconductor componentsTEXAS INSTRUMENTS INC·Filed 2020·Granted Dec 14, 2021·0 cites·15 claims
- 2461US2025311248A1Capacitor and method for fabricating the sameTEXAS INSTRUMENTS INC·Filed 2024·Application pending·0 cites
- 2560US12027572B2Integrated semiconductor device isolation packageTEXAS INSTRUMENTS INC·Filed 2021·Granted Jul 2, 2024·0 cites·16 claims
- 2659US12191252B2Semiconductor fuse with multi-bond wireTEXAS INSTRUMENTS INC·Filed 2021·Granted Jan 7, 2025·0 cites·21 claims
- 2759US11569396B2Optical sensor package with optically transparent mold compoundTEXAS INSTRUMENTS INC·Filed 2020·Granted Jan 31, 2023·0 cites·27 claims
- 2859US2025140628A1Dielectric layer protrusionsTEXAS INSTRUMENTS INC·Filed 2023·Application pending·0 cites
- 2958US11838004B2Acoustic device package and method of makingTEXAS INSTRUMENTS INC·Filed 2019·Granted Dec 5, 2023·0 cites·17 claims
- 3058US10998256B2High voltage semiconductor device lead frame and method of fabricationTEXAS INSTRUMENTS INC·Filed 2019·Granted May 4, 2021·0 cites·17 claims
- 3158US2024355700A1Die-package interconnect to facilitate thermal conductionTEXAS INSTRUMENTS INC·Filed 2023·Application pending·0 cites
- 3257US11881461B2Electric field control for bond pads in semiconductor device packageTEXAS INSTRUMENTS INC·Filed 2021·Granted Jan 23, 2024·0 cites·17 claims
- 3357US11879790B2Isolated temperature sensor package with embedded spacer in dielectric openingTEXAS INSTRUMENTS INC·Filed 2021·Granted Jan 23, 2024·0 cites·15 claims
- 3457US11594474B2Bondwire protrusions on conductive membersTEXAS INSTRUMENTS INC·Filed 2021·Granted Feb 28, 2023·0 cites·21 claims
- 3557US11552013B2Fuses for packaged semiconductor devicesTEXAS INSTRUMENTS INC·Filed 2021·Granted Jan 10, 2023·0 cites·28 claims
- 3657US2025105104A1Quad flat no-lead package with enhanced corner pads for board level reliabilityTEXAS INSTRUMENTS INC·Filed 2023·Application pending·0 cites
- 3757US2025246492A1Ic package with interconnectTEXAS INSTRUMENTS INC·Filed 2024·Application pending·0 cites
- 3856US8593782B1Clad fiber capacitor and method of making sameTUNCER ENIS·Filed 2012·Granted Nov 26, 2013·0 cites·5 claims
- 3955US11569153B2Leadframes with folded conductor portion and devices therefromTEXAS INSTRUMENTS INC·Filed 2020·Granted Jan 31, 2023·0 cites·26 claims
- 4055US10883953B2Semiconductor device for sensing impedance changes in a mediumTEXAS INSTRUMENTS INC·Filed 2018·Granted Jan 5, 2021·0 cites·16 claims
- 4154US12243911B2Integrated circuit package for isolation diesTEXAS INSTRUMENTS INC·Filed 2020·Granted Mar 4, 2025·0 cites·6 claims
- 4252US10284172B2Acoustic device package and method of makingTEXAS INSTRUMENTS INC·Filed 2015·Granted May 7, 2019·0 cites·16 claims
- 4352US2025183133A1Semiconductor device package with integrated laminate transformerTEXAS INSTRUMENTS INC·Filed 2023·Application pending·0 cites
- 4451US11756882B2Semiconductor die with blast shieldingTEXAS INSTRUMENTS INC·Filed 2020·Granted Sep 12, 2023·0 cites·39 claims
- 4550US2023014718A1Semiconductor package with temperature sensorTEXAS INSTRUMENTS INC·Filed 2021·Application pending·0 cites
- 4645US2021305024A1Plasma cleaning for packaging electronic devicesTEXAS INSTRUMENTS INC·Filed 2020·Application pending·0 cites
- 4745US2021210462A1Chip scale package with redistribution layer interruptsTEXAS INSTRUMENTS INC·Filed 2020·Application pending·0 cites
- 4844US2015134109A1Switched capacitive devices and method of operating such devicesGEN ELECTRIC·Filed 2013·Application pending·0 cites
- 4944US2010178418A1Device fabrication method for high power density capacitorsTUNCER ENIS·Filed 2009·Application pending·0 cites
- 5044US2010177461A1Well defined structures for capacitor applicationsUT BATTELLE LLC·Filed 2009·Application pending·0 cites
Showing the top 50 of 56 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →