Inventor · disambiguated record
Enbo Wang
Also filed as: WANG ENBO
19 granted patents·5 pending applications·24 citations·filing 2014–2024
90Inventor score
Top patents by PatentIndex Score
24 records- 0192US10892280B2Inter-deck plug in three-dimensional memory device and method for forming the sameYANGTZE MEMORY TECH CO LTD·Filed 2020·Granted Jan 12, 2021·3 cites·20 claims
- 0292US10658378B2Through array contact (TAC) for three-dimensional memory devicesYANGTZE MEMORY TECH CO LTD·Filed 2018·Granted May 19, 2020·9 cites·20 claims
- 0387US10937806B2Through array contact (TAC) for three-dimensional memory devicesYANGTZE MEMORY TECH CO LTD·Filed 2020·Granted Mar 2, 2021·2 cites·20 claims
- 0482US10741578B2Inter-deck plug in three-dimensional memory device and method for forming the sameYANGTZE MEMORY TECH CO LTD·Filed 2018·Granted Aug 11, 2020·3 cites·19 claims
- 0581US10714493B2Semiconductor plug protected by protective dielectric layer in three-dimensional memory device and method for forming the sameYANGTZE MEMORY TECH CO LTD·Filed 2018·Granted Jul 14, 2020·3 cites·20 claims
- 0679US12446217B23D NAND memory device and method of forming the sameYANGTZE MEMORY TECH CO LTD·Filed 2023·Granted Oct 14, 2025·0 cites·20 claims
- 0772US11737263B23D NAND memory device and method of forming the sameYANGTZE MEMORY TECH CO LTD·Filed 2021·Granted Aug 22, 2023·0 cites·10 claims
- 0872US10419991B2Data transmission method and system, and related apparatusHUAWEI TECH CO LTD·Filed 2016·Granted Sep 17, 2019·2 cites·7 claims
- 0969US10679985B2Three-dimensional memory device having semiconductor plug formed using backside substrate thinningYANGTZE MEMORY TECH CO LTD·Filed 2018·Granted Jun 9, 2020·1 cites·20 claims
- 1068US10651193B2Memory device and forming method thereofYANGTZE MEMORY TECH CO LTD·Filed 2018·Granted May 12, 2020·1 cites·22 claims
- 1163US2024349086A1Communication method and communication apparatusHUAWEI TECH CO LTD·Filed 2024·Application pending·0 cites
- 1261US11805643B2Method of fabrication thereof a multi-level vertical memory device including inter-level channel connectorYANGTZE MEMORY TECH CO LTD·Filed 2021·Granted Oct 31, 2023·0 cites·20 claims
- 1360US2024106722A1Communication method using artificial intelligence and communication apparatusHUAWEI TECH CO LTD·Filed 2023·Application pending·0 cites
- 1455US11502094B2Multi-level vertical memory device including inter-level channel connectorYANGTZE MEMORY TECH CO LTD·Filed 2019·Granted Nov 15, 2022·0 cites·13 claims
- 1554US2024137199A1Clock frequency determining method and apparatusHUAWEI TECH CO LTD·Filed 2023·Application pending·0 cites
- 1653US2024086236A1Computing node management method and systemHUAWEI TECH CO LTD·Filed 2023·Application pending·0 cites
- 1751US11716843B2Method for forming contact structures in three-dimensional memory devicesYANGTZE MEMORY TECH CO LTD·Filed 2020·Granted Aug 1, 2023·0 cites·22 claims
- 1849US11894995B2Data processing method and apparatusHUAWEI TECH CO LTD·Filed 2022·Granted Feb 6, 2024·0 cites·14 claims
- 1949US11145667B23D NAND memory device and method of forming the sameYANGTZE MEMORY TECH CO LTD·Filed 2019·Granted Oct 12, 2021·0 cites·20 claims
- 2049US10665500B1Methods of semiconductor device fabricationYANGTZE MEMORY TECH CO LTD·Filed 2019·Granted May 26, 2020·0 cites·20 claims
- 2149US9602632B2Content encoding pre-synchronization method, device and systemHUAWEI TECH CO LTD·Filed 2014·Granted Mar 21, 2017·0 cites·18 claims
- 2238US10299164B2Protocol stack adaptation method and apparatusHUAWEI TECH CO LTD·Filed 2016·Granted May 21, 2019·0 cites·17 claims
- 2337US2017078916A1Data processing method and apparatusHUAWEI TECH CO LTD·Filed 2016·Application pending·0 cites
- 2433US9900259B2Data transmission method and related apparatus to compress data to be transmitted on a networkHUAWEI TECH CO LTD·Filed 2015·Granted Feb 20, 2018·0 cites·14 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →