Inventor · disambiguated record
Eng Wah Woo
Also filed as: WOO ENG WAH
7 granted patents·4 pending applications·0 citations·filing 2020–2024
69Inventor score
Technology areasH10W
Top patents by PatentIndex Score
11 records- 0175US12451413B2Packaged semiconductor devices with leadframes having tie bar with recessed cavityMACOM TECH SOLUTIONS HOLDINGS INC·Filed 2024·Granted Oct 21, 2025·0 cites·19 claims
- 0266US12470185B2Semiconductor device packages with exposed heat dissipating surfaces and methods of fabricating the sameWOLFSPEED INC·Filed 2022·Granted Nov 11, 2025·0 cites·31 claims
- 0364US12009286B2Methods of forming packaged semiconductor devices and leadframes for semiconductor device packagesMACOM TECH SOLUTIONS HOLDINGS INC·Filed 2021·Granted Jun 11, 2024·0 cites·15 claims
- 0455US11581859B2Radio frequency (RF) transistor amplifier packages with improved isolation and lead configurationsCREE INC·Filed 2020·Granted Feb 14, 2023·0 cites·41 claims
- 0555US2023327624A1Rf amplifier devices and methods of manufacturing including modularized designs with flip chip interconnections and integration into packagingWOLFSPEED INC·Filed 2023·Application pending·0 cites
- 0653US11935879B2Integrated passive device (IPD) components and a package and processes implementing the sameCREE INC·Filed 2021·Granted Mar 19, 2024·0 cites·56 claims
- 0752US12315836B2Limiting failures caused by dendrite growth on semiconductor chipsWOLFSPEED INC·Filed 2022·Granted May 27, 2025·0 cites·29 claims
- 0851US12119239B2Packaged semiconductor devices, and package molds for forming packaged semiconductor devicesWOLFSPEED INC·Filed 2021·Granted Oct 15, 2024·0 cites·12 claims
- 0951US2024105570A1Transistor package and process of implementing the transistor packageWOLFSPEED INC·Filed 2022·Application pending·0 cites
- 1050US2023402360A1Power package having connected components and processes implementing the sameWOLFSPEED INC·Filed 2022·Application pending·0 cites
- 1150US2024105390A1Device and process for implementing silicon carbide (sic) surface mount devicesWOLFSPEED INC·Filed 2022·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →