Inventor · disambiguated record
Eon Soo Jang
Also filed as: JANG EON SOO
11 granted patents·1 pending application·89 citations·filing 2014–2025
89Inventor score
Technology areasH10W
Top patents by PatentIndex Score
12 records- 0198US11862618B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jan 2, 2024·9 cites·19 claims
- 0292US10546844B2Stack package and method of manufacturing the stack packageSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Jan 28, 2020·15 cites·16 claims
- 0392US9029998B2Semiconductor package deviceSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted May 12, 2015·17 cites·20 claims
- 0488US9842799B2Semiconductor packages including upper and lower packages and heat dissipation partsSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted Dec 12, 2017·7 cites·18 claims
- 0588US9583430B2Package-on-package devicePARK KYOL·Filed 2014·Granted Feb 28, 2017·16 cites·16 claims
- 0687US9653373B2Semiconductor package including heat spreader and method for manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted May 16, 2017·7 cites·8 claims
- 0783US9391009B2Semiconductor packages including heat exhaust partJANG EON SOO·Filed 2014·Granted Jul 12, 2016·10 cites·19 claims
- 0881US12308363B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted May 20, 2025·0 cites·19 claims
- 0979US9190338B2Semiconductor package having a heat slug and a spacerSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Nov 17, 2015·5 cites·15 claims
- 1078US2025266415A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 1174US11205604B2Semiconductor package including a thermal conductive layer and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Dec 21, 2021·2 cites·16 claims
- 1264US9704815B2Package substrate and semiconductor package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Jul 11, 2017·1 cites·18 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →