Inventor · disambiguated record
Erwin Ian V. Almagro
Also filed as: ALMAGRO ERWIN IAN · ALMAGRO ERWIN IAN V · ALMAGRO ERWIN IAN VAMENTA
9 granted patents·1 pending application·6 citations·filing 2007–2024
79Inventor score
Technology areasH10W
Top patents by PatentIndex Score
10 records- 0193US11791247B2Concealed gate terminal semiconductor packages and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2021·Granted Oct 17, 2023·2 cites·20 claims
- 0276US12300583B2Concealed gate terminal semiconductor packages and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2023·Granted May 13, 2025·0 cites·20 claims
- 0375US2024429136A1Molded packaging for wide band gap semiconductor devicesSEMICONDUCTOR COMPONENTS IND LLC·Filed 2024·Application pending·0 cites
- 0472US11735508B2Vertical and horizontal circuit assembliesSEMICONDUCTOR COMPONENTS IND LLC·Filed 2021·Granted Aug 22, 2023·0 cites·20 claims
- 0566US7586179B2Wireless semiconductor package for efficient heat dissipationFAIRCHILD SEMICONDUCTOR·Filed 2007·Granted Sep 8, 2009·4 cites·13 claims
- 0661US12087677B2Molded packaging for wide band gap semiconductor devicesSEMICONDUCTOR COMPONENTS IND LLC·Filed 2021·Granted Sep 10, 2024·0 cites·13 claims
- 0759US11177203B2Vertical and horizontal circuit assembliesFAIRCHILD SEMICONDUCTOR·Filed 2019·Granted Nov 16, 2021·0 cites·22 claims
- 0855US10256178B2Vertical and horizontal circuit assembliesFAIRCHILD SEMICONDUCTOR·Filed 2017·Granted Apr 9, 2019·0 cites·20 claims
- 0948US7800207B2Method for connecting a die attach pad to a lead frame and product thereofFAIRCHILD SEMICONDUCTOR·Filed 2007·Granted Sep 21, 2010·0 cites·14 claims
- 1038US8110492B2Method for connecting a die attach pad to a lead frame and product thereofALMAGRO ERWIN IAN V·Filed 2010·Granted Feb 7, 2012·0 cites·2 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →