Inventor · disambiguated record
Ernesto Antilano, Jr.
Also filed as: ANTILANO JR ERNESTO
6 granted patents·2 pending applications·35 citations·filing 2016–2025
76Inventor score
Files withST MICROELECTRONICS INC8
Top patents by PatentIndex Score
8 records- 0195US10079198B1QFN pre-molded leadframe having a solder wettable sidewall on each leadST MICROELECTRONICS INC·Filed 2017·Granted Sep 18, 2018·34 cites·16 claims
- 0283US2025343119A1Bottom package exposed die mems pressure sensor integrated circuit package designST MICROELECTRONICS INC·Filed 2025·Application pending·0 cites
- 0366US10796984B2Leadframe having a conductive layer protruding through a lead recessST MICROELECTRONICS INC·Filed 2019·Granted Oct 6, 2020·1 cites·21 claims
- 0463US10910295B2QFN pre-molded leadframe having a solder wettable sidewall on each leadST MICROELECTRONICS INC·Filed 2019·Granted Feb 2, 2021·0 cites·20 claims
- 0558US11355423B2Bottom package exposed die MEMS pressure sensor integrated circuit package designST MICROELECTRONICS INC·Filed 2019·Granted Jun 7, 2022·0 cites·20 claims
- 0658US10541196B2QFN pre-molded leadframe having a solder wettable sidewall on each leadST MICROELECTRONICS INC·Filed 2018·Granted Jan 21, 2020·0 cites·19 claims
- 0749US10483191B2Bottom package exposed die MEMS pressure sensor integrated circuit package designST MICROELECTRONICS INC·Filed 2016·Granted Nov 19, 2019·0 cites·18 claims
- 0842US2018190575A1Leadframe with lead protruding from the packageST MICROELECTRONICS INC·Filed 2017·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →