Inventor · disambiguated record
Eric Beyne
Also filed as: BEYNE ERIC
68 granted patents·22 pending applications·2,494 citations·filing 1995–2025
99Inventor score
Top patents by PatentIndex Score
90 records- 0199US9966325B2Semiconductor die package and method of producing the packageIMEC VZW·Filed 2017·Granted May 8, 2018·61 cites·14 claims
- 0298US10636739B2Integrated circuit chip with power delivery network on the backside of the chipIMEC VZW·Filed 2017·Granted Apr 28, 2020·89 cites·20 claims
- 0398US6566745B1Image sensor ball grid array package and the fabrication thereofIMEC VZW·Filed 2000·Granted May 20, 2003·414 cites·13 claims
- 0497US6876056B2Method and system for fabrication of integrated tunable/switchable passive microwave and millimeter wave modulesIMEC INTER UNI MICRO ELECTR·Filed 2002·Granted Apr 5, 2005·239 cites·4 claims
- 0596US7566634B2Method for chip singulationIMEC INTER UNI MICRO ELECTR·Filed 2005·Granted Jul 28, 2009·53 cites·30 claims
- 0694US7835157B2System for fabrication of integrated tunable/switchable passive microwave and millimeter wave modulesIMEC·Filed 2007·Granted Nov 16, 2010·28 cites·19 claims
- 0794US6297072B1Method of fabrication of a microstructure having an internal cavityINTERUNIVERSITAIR MICRO ELKTRO·Filed 1999·Granted Oct 2, 2001·422 cites·42 claims
- 0893US8907471B2Window interposed die packagingBEYNE ERIC·Filed 2010·Granted Dec 9, 2014·41 cites·20 claims
- 0993US8742590B2Method for forming isolation trenchesBEYNE ERIC·Filed 2011·Granted Jun 3, 2014·18 cites·23 claims
- 1093US6908856B2Method for producing electrical through hole interconnects and devices made thereofIMEC INTER UNI MICRO ELECTR·Filed 2004·Granted Jun 21, 2005·108 cites·53 claims
- 1193US6506664B1Method of transferring ultra-thin substrates and application of the method to the manufacture of a multi-layer thin film deviceIMEC VZW·Filed 2000·Granted Jan 14, 2003·176 cites·12 claims
- 1291US11769750B2Substrate, assembly and method for wafer-to-wafer hybrid bondingIMEC VZW·Filed 2021·Granted Sep 26, 2023·2 cites·5 claims
- 1391US9960080B2Method for bonding and interconnecting integrated circuit devicesIMEC VZW·Filed 2016·Granted May 1, 2018·8 cites·18 claims
- 1491US7880315B2Methods for bonding and micro-electronic devices produced according to such methodsIMEC·Filed 2009·Granted Feb 1, 2011·27 cites·4 claims
- 1591US6362484B1Imager or particle or radiation detector and method of manufacturing the sameIMEC VZW·Filed 1999·Granted Mar 26, 2002·103 cites·43 claims
- 1690US11476162B2Method for dicing a semiconductor substrate into a plurality of diesIMEC VZW·Filed 2020·Granted Oct 18, 2022·3 cites·20 claims
- 1790US9978710B2Method for self-aligned solder reflow bonding and devices obtained thereofIMEC VZW·Filed 2016·Granted May 22, 2018·13 cites·10 claims
- 1889US9646930B2Semiconductor device having through-substrate viasIMEC·Filed 2014·Granted May 9, 2017·12 cites·16 claims
- 1989US9601459B2Method for aligning micro-electronic componentsIMEC VZW·Filed 2014·Granted Mar 21, 2017·11 cites·15 claims
- 2089US7547625B2Methods for bonding and micro-electronic devices produced according to such methodsIMEC INTER UNI MICRO ELECTR·Filed 2006·Granted Jun 16, 2009·21 cites·9 claims
- 2189US6730997B2Method of transferring ultra-thin substrates and application of the method to the manufacture of a multi-layered thin film deviceIMEC VZW·Filed 2002·Granted May 4, 2004·69 cites·11 claims
- 2288US10334755B2Liquid cooling of electronic devicesIMEC VZW·Filed 2016·Granted Jun 25, 2019·11 cites·12 claims
- 2388US7368311B2Method and system for fabrication of integrated tunable/switchable passive microwave and millimeter wave modulesIMEC INTER UNI MICRO ELECTR·Filed 2004·Granted May 6, 2008·38 cites·5 claims
- 2487US11367705B2Method for packaging semiconductor diesIMEC VZW·Filed 2019·Granted Jun 21, 2022·4 cites·13 claims
- 2587US10886252B2Method of bonding semiconductor substratesIMEC VZW·Filed 2018·Granted Jan 5, 2021·8 cites·20 claims
- 2687US7737552B2Device having a bonding structure for two elementsIMEC·Filed 2008·Granted Jun 15, 2010·13 cites·31 claims
- 2787US7378297B2Methods of bonding two semiconductor devicesIMEC INTER UNI MICRO ELECTR·Filed 2006·Granted May 27, 2008·13 cites·22 claims
- 2886US10985057B2Method for contacting a buried interconnect rail of an integrated circuit chip from the back side of the ICIMEC VZW·Filed 2019·Granted Apr 20, 2021·8 cites·10 claims
- 2986US10170450B2Method for bonding and interconnecting integrated circuit devicesIMEC VZW·Filed 2017·Granted Jan 1, 2019·6 cites·11 claims
- 3085US7795113B2Method for bonding a die or substrate to a carrierIMEC·Filed 2007·Granted Sep 14, 2010·11 cites·11 claims
- 3184US8647920B2Method for forming 3D-interconnect structures with airgapsTEZCAN DENIZ SABUNCUOGLU·Filed 2011·Granted Feb 11, 2014·12 cites·23 claims
- 3283US8493736B2Device for cooling integrated circuitsOPRINS HERMAN·Filed 2011·Granted Jul 23, 2013·13 cites·11 claims
- 3383US5731584APosition sensitive particle sensor and manufacturing method thereforIMEC VZW·Filed 1996·Granted Mar 24, 1998·78 cites·36 claims
- 3481US8536047B2Methods and systems for material bondingZHANG WENQI·Filed 2011·Granted Sep 17, 2013·9 cites·13 claims
- 3574US9508665B2Method for insertion bonding and device thus obtainedBEYNE ERIC·Filed 2010·Granted Nov 29, 2016·5 cites·19 claims
- 3673US7687904B2Plurality of devices attached by solder bumpsIMEC·Filed 2007·Granted Mar 30, 2010·5 cites·65 claims
- 3773US6278410B1Wide frequency band planar antennaIMEC INTER UNI MICRO ELECTR·Filed 1999·Granted Aug 21, 2001·52 cites·18 claims
- 3872US8809188B2Method for fabricating through substrate viasTEZCAN DENIZ SABUNCUOGLU·Filed 2010·Granted Aug 19, 2014·4 cites·15 claims
- 3970US6711813B1Method for fabricating a thin film build-up structure on a sequentially laminated printed circuit board baseIMEC INTER UNI MICRO ELECTR·Filed 2000·Granted Mar 30, 2004·18 cites·8 claims
- 4070US6121622AImager or particle detector and method of manufacturing the sameYEDA RES & DEV·Filed 1998·Granted Sep 19, 2000·38 cites·30 claims
- 4170US5929516APolymer stud grid arraySIEMENS NV·Filed 1995·Granted Jul 27, 1999·45 cites·10 claims
- 4266US5927853AMethod for thermal impedance evaluation of packaged semiconductor componentsFiled 1996·Granted Jul 27, 1999·31 cites·6 claims
- 4366US5675295AMicrowave oscillator, an antenna therefor and methods of manufactureIMEC VZW·Filed 1996·Granted Oct 7, 1997·39 cites·14 claims
- 4465US10332850B2Method for producing contact areas on a semiconductor substrateIMEC·Filed 2014·Granted Jun 25, 2019·2 cites·14 claims
- 4565US6576505B2Method for transferring and stacking of semiconductor devicesIMEC VZW·Filed 2001·Granted Jun 10, 2003·15 cites·27 claims
- 4664US9048198B2Biocompatible packagingOP DE BEECK MARIA·Filed 2011·Granted Jun 2, 2015·3 cites·20 claims
- 4763US2025118564A1Method for Thinning a Semiconductor SubstrateIMEC VZW·Filed 2024·Application pending·0 cites
- 4860US6130478APolymer stud grid array for microwave circuit arrangementsSIEMENS NV·Filed 1996·Granted Oct 10, 2000·31 cites·10 claims
- 4960US2025118691A1Semiconductor Component Comprising Structured Contacts and A Method for Producing the ComponentIMEC VZW·Filed 2024·Application pending·0 cites
- 5059US2024222260A1Semiconductor component with metal-insulator-metal capacitor assemblyIMEC VZW·Filed 2023·Application pending·0 cites
Showing the top 50 of 90 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →