Inventor · disambiguated record
Eric J. Chapman
Also filed as: CHAPMAN ERIC J · CHAPMAN ERIC JOHN
2 granted patents·3 pending applications·2 citations·filing 2021–2022
35Inventor score
Files withADVANCED MICRO DEVICES INC5
Top patents by PatentIndex Score
5 records- 0188US11960339B2Multi-die stacked power deliveryADVANCED MICRO DEVICES INC·Filed 2021·Granted Apr 16, 2024·2 cites·17 claims
- 0261US11960340B2Performance management during power supply voltage droopADVANCED MICRO DEVICES INC·Filed 2021·Granted Apr 16, 2024·0 cites·19 claims
- 0352US2025329656A1Apparatus, system, and method for integrating passive elements into electronic bridge componentsADVANCED MICRO DEVICES INC·Filed 2022·Application pending·0 cites
- 0450US2025201722A1Apparatuses and methods for bridge-based packaging with direct power deliveryADVANCED MICRO DEVICES INC·Filed 2022·Application pending·0 cites
- 0549US2024113004A1Connecting a chiplet to an interposer die and to a package interface using a spacer interconnect coupled to a portion of the chipletADVANCED MICRO DEVICES INC·Filed 2022·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →