Inventor · disambiguated record
Eric Duchesne
Also filed as: DUCHESNE ERIC
17 granted patents·3 pending applications·231 citations·filing 1998–2017
93Inventor score
Top patents by PatentIndex Score
20 records- 0189US6104093AThermally enhanced and mechanically balanced flip chip package and method of formingIBM·Filed 1998·Granted Aug 15, 2000·92 cites·15 claims
- 0288US6410988B1Thermally enhanced and mechanically balanced flip chip package and method of formingIBM·Filed 2000·Granted Jun 25, 2002·45 cites·18 claims
- 0387US8710161B2Method for transforming a single reactor lineFOUARGE LOUIS·Filed 2007·Granted Apr 29, 2014·9 cites·18 claims
- 0483US6819566B1Grounding and thermal dissipation for integrated circuit packagesIBM·Filed 2003·Granted Nov 16, 2004·34 cites·8 claims
- 0582US9818717B2Enhanced cleaning for water-soluble flux solderingIBM·Filed 2016·Granted Nov 14, 2017·2 cites·13 claims
- 0678US8822609B2Method for transforming a single reactor lineTOTAL RES & TECHNOLOGY FELUY·Filed 2014·Granted Sep 2, 2014·2 cites·17 claims
- 0774US7740713B2Flux composition and techniques for use thereofIBM·Filed 2004·Granted Jun 22, 2010·17 cites·30 claims
- 0871US7780801B2Flux composition and process for use thereofIBM·Filed 2006·Granted Aug 24, 2010·5 cites·7 claims
- 0965US7484190B1Method to optimize the manufacturing of interconnects in microelectronic packagesIBM·Filed 2008·Granted Jan 27, 2009·3 cites·1 claims
- 1061US10739209B2Carbon nanotube-based multi-sensorIBM·Filed 2017·Granted Aug 11, 2020·1 cites·11 claims
- 1159US10636763B2Enhanced cleaning for water-soluble flux solderingIBM·Filed 2017·Granted Apr 28, 2020·0 cites·18 claims
- 1259US6545869B2Adjusting fillet geometry to couple a heat spreader to a chip carrierIBM·Filed 2001·Granted Apr 8, 2003·8 cites·19 claims
- 1356US7176563B2Electronically grounded heat spreaderIBM·Filed 2003·Granted Feb 13, 2007·7 cites·10 claims
- 1455US6984286B2Adjusting fillet geometry to couple a heat spreader to a chip carrierIBM·Filed 2003·Granted Jan 10, 2006·6 cites·27 claims
- 1548US9162937B2Process to make olefins from organics with reduced side reactionsGRASSO GIACOMO·Filed 2009·Granted Oct 20, 2015·0 cites·19 claims
- 1648US7771541B2Method of removing metallic, inorganic and organic contaminants from chip passivation layer surfacesIBM·Filed 2007·Granted Aug 10, 2010·0 cites·19 claims
- 1746US10564047B2Carbon nanotube-based multi-sensorIBM·Filed 2017·Granted Feb 18, 2020·0 cites·3 claims
- 1845US2009298206A1Method and apparatus to minimize stress during reflow processIBM·Filed 2008·Application pending·0 cites
- 1943US2008230901A1Structure for controlled collapse chip connection with displaced captured padsIBM·Filed 2007·Application pending·0 cites
- 2042US2010218894A1Method of Removing Metallic, Inorganic and Organic Contaminants From Chip Passivation Layer SurfacesIBM·Filed 2010·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →