Inventor · disambiguated record
Erwin Estepa
Also filed as: ESTEPA ERWIN R · ESTEPA ERWIN REMOBLAS
1 granted patent·4 pending applications·14 citations·filing 2000–2007
36Inventor score
Technology areasH10W
Top patents by PatentIndex Score
5 records- 0159US6969638B2Low cost substrate for an integrated circuit device with bondpads free of plated goldTEXAS INSTRUMENTS INC·Filed 2003·Granted Nov 29, 2005·14 cites·17 claims
- 0234US2006024974A1Surface treatment for oxidation removal in integrated circuit package assembliesTEXAS INSTRUMENTS INC·Filed 2005·Application pending·0 cites
- 0333US2009206460A1Intermediate Bond Pad for Stacked Semiconductor Chip PackageREYES ELAINE BAUTISTA·Filed 2007·Application pending·0 cites
- 0432US2008003718A1Singulation Process for Block-Molded PackagesESTEPA ERWIN REMOBLAS·Filed 2006·Application pending·0 cites
- 0513US2002030261A1Multi-flip-chip semiconductor assemblyFiled 2000·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →