Inventor · disambiguated record
Eric M. Hubacher
Also filed as: HUBACHER ERIC M · HUBACHER ERIC MAX
6 granted patents·906 citations·filing 1974–1997
89Inventor score
Top patents by PatentIndex Score
6 records- 0197US5492266AFine pitch solder deposits on printed circuit board process and productIBM·Filed 1994·Granted Feb 20, 1996·195 cites·13 claims
- 0295US4038599AHigh density wafer contacting and test systemIBM·Filed 1974·Granted Jul 26, 1977·329 cites·5 claims
- 0394US5554940ABumped semiconductor device and method for probing the sameMOTOROLA INC·Filed 1994·Granted Sep 10, 1996·209 cites·19 claims
- 0490US5762259AMethod for forming bumps on a substrateMOTOROLA INC·Filed 1997·Granted Jun 9, 1998·88 cites·20 claims
- 0578US5536677AMethod of forming conductive bumps on a semiconductor device using a double mask structureMOTOROLA INC·Filed 1994·Granted Jul 16, 1996·48 cites·17 claims
- 0676US5825629APrint circuit board product with stencil controlled fine pitch solder formation for fine and coarse pitch component attachmentIBM·Filed 1996·Granted Oct 20, 1998·37 cites·1 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →