Inventor · disambiguated record
Eric H. Laine
Also filed as: LAINE ERIC H · LAINE ERIC HERMAN
8 granted patents·320 citations·filing 1995–2009
89Inventor score
Technology areasH10W
Top patents by PatentIndex Score
8 records- 0192US5616958AElectronic packageIBM·Filed 1995·Granted Apr 1, 1997·122 cites·23 claims
- 0281US5939783AElectronic packageIBM·Filed 1998·Granted Aug 17, 1999·68 cites·15 claims
- 0377US5751060AElectronic packageIBM·Filed 1997·Granted May 12, 1998·43 cites·17 claims
- 0473US5728606AElectronic PackageIBM·Filed 1996·Granted Mar 17, 1998·35 cites·8 claims
- 0569US5952716APin attach structure for an electronic packageIBM·Filed 1997·Granted Sep 14, 1999·33 cites·11 claims
- 0665US8314500B2Interconnections for flip-chip using lead-free solders and having improved reaction barrier layersBELANGER LUC·Filed 2006·Granted Nov 20, 2012·4 cites·1 claims
- 0759US7932169B2Interconnection for flip-chip using lead-free solders and having improved reaction barrier layersIBM·Filed 2009·Granted Apr 26, 2011·1 cites·3 claims
- 0849US6438830B1Process of producing plastic pin grid arrayIBM·Filed 1999·Granted Aug 27, 2002·14 cites·4 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →