Inventor · disambiguated record
Eric J. Li
Also filed as: LI ERIC · LI ERIC J · Li Eric Jin
51 granted patents·9 pending applications·246 citations·filing 2004–2022
98Inventor score
Top patents by PatentIndex Score
60 records- 0196US11955434B2Ultra small molded module integrated with die by module-on-wafer assemblyINTEL CORP·Filed 2022·Granted Apr 9, 2024·2 cites·22 claims
- 0295US9922751B2Helically insulated twinax cable systems and methodsINTEL CORP·Filed 2016·Granted Mar 20, 2018·9 cites·10 claims
- 0394US11075166B2Microelectronic structures having multiple microelectronic devices connected with a microelectronic bridge embedded in a microelectronic substrateINTEL CORP·Filed 2020·Granted Jul 27, 2021·3 cites·18 claims
- 0493US10418329B2Microelectronic structures having multiple microelectronic devices connected with a microelectronic bridge embedded in a microelectronic substrateINTEL CORP·Filed 2015·Granted Sep 17, 2019·11 cites·23 claims
- 0593US10121722B1Architecture material and process to improve thermal performance of the embedded die packageINTEL CORP·Filed 2017·Granted Nov 6, 2018·12 cites·25 claims
- 0693US7393468B2Adhesive with differential optical properties and its application for substrate processingINTEL CORP·Filed 2005·Granted Jul 1, 2008·20 cites·5 claims
- 0792US10573608B2Microelectronic devices designed with high frequency communication devices including compound semiconductor devices integrated on a die fabric on packageINTEL CORP·Filed 2015·Granted Feb 25, 2020·9 cites·22 claims
- 0891US9842818B2Variable ball height on ball grid array packages by solder paste transferINTEL CORP·Filed 2016·Granted Dec 12, 2017·7 cites·16 claims
- 0991US9685413B1Semiconductor package having an EMI shielding layerINTEL CORP·Filed 2016·Granted Jun 20, 2017·12 cites·16 claims
- 1089US7279362B2Semiconductor wafer coat layers and methods thereforINTEL CORP·Filed 2005·Granted Oct 9, 2007·18 cites·8 claims
- 1189US7169687B2Laser micromachining methodINTEL CORP·Filed 2004·Granted Jan 30, 2007·43 cites·24 claims
- 1286US10707171B2Ultra small molded module integrated with die by module-on-wafer assemblyINTEL CORP·Filed 2015·Granted Jul 7, 2020·5 cites·8 claims
- 1386US8193072B2Semiconductor wafer coat layers and methods thereforLI ERIC J·Filed 2010·Granted Jun 5, 2012·9 cites·9 claims
- 1484US9741692B2Methods to form high density through-mold interconnectionsKARHADE OMKAR G·Filed 2014·Granted Aug 22, 2017·7 cites·14 claims
- 1583US10163810B2Electromagnetic interference shielding for system-in-package technologyINTEL CORP·Filed 2015·Granted Dec 25, 2018·4 cites·19 claims
- 1683US7611966B2Dual pulsed beam laser micromachining methodINTEL CORP·Filed 2005·Granted Nov 3, 2009·8 cites·17 claims
- 1782US7767563B2Method of forming a silicide layer on a thinned silicon wafer, and related semiconducting structureINTEL CORP·Filed 2007·Granted Aug 3, 2010·10 cites·7 claims
- 1879US10373888B2Electronic package assembly with compact die placementINTEL CORP·Filed 2016·Granted Aug 6, 2019·3 cites·13 claims
- 1979US7897486B2Semiconductor wafer coat layers and methods thereforINTEL CORP·Filed 2007·Granted Mar 1, 2011·7 cites·7 claims
- 2078US9953929B2Systems and methods for electromagnetic interference shieldingINTEL CORP·Filed 2016·Granted Apr 24, 2018·2 cites·7 claims
- 2178US7807573B2Laser assisted chemical vapor deposition for backside die marking and structures formed therebyINTEL CORP·Filed 2008·Granted Oct 5, 2010·8 cites·11 claims
- 2277US11328968B2Stacked die cavity packageINTEL CORP·Filed 2016·Granted May 10, 2022·2 cites·18 claims
- 2377US10256198B2Warpage control for microelectronics packagesINTEL CORP·Filed 2017·Granted Apr 9, 2019·2 cites·21 claims
- 2476US10249515B2Electronic device packageINTEL CORP·Filed 2016·Granted Apr 2, 2019·2 cites·9 claims
- 2574US9991211B2Semiconductor package having an EMI shielding layerINTEL CORP·Filed 2017·Granted Jun 5, 2018·2 cites·14 claims
- 2673US11903138B2Fine feature formation techniques for printed circuit boardsINTEL CORP·Filed 2021·Granted Feb 13, 2024·0 cites·24 claims
- 2773US10504863B2Variable ball height on ball grid array packages by solder paste transferINTEL CORP·Filed 2018·Granted Dec 10, 2019·1 cites·14 claims
- 2873US7553386B2Adhesive with differential optical properties and its application for substrate processingINTEL CORP·Filed 2008·Granted Jun 30, 2009·3 cites·9 claims
- 2972US11705377B2Stacked die cavity packageINTEL CORP·Filed 2022·Granted Jul 18, 2023·0 cites·7 claims
- 3072US11676900B2Electronic assembly that includes a bridgeINTEL CORP·Filed 2015·Granted Jun 13, 2023·2 cites·12 claims
- 3172US9659899B2Die warpage control for thin die assemblyINTEL CORP·Filed 2015·Granted May 23, 2017·2 cites·20 claims
- 3270US10672626B2Method and materials for warpage thermal and interconnect solutionsINTEL CORP·Filed 2017·Granted Jun 2, 2020·1 cites·7 claims
- 3370US10224290B2Electromagnetically shielded electronic devices and related systems and methodsINTEL CORP·Filed 2015·Granted Mar 5, 2019·2 cites·20 claims
- 3470US9390968B2Low temperature thin wafer backside vacuum process with backgrinding tapeLI ERIC J·Filed 2011·Granted Jul 12, 2016·2 cites·19 claims
- 3570US7118989B2Method of forming vias on a wafer stack using laser ablationINTEL CORP·Filed 2004·Granted Oct 10, 2006·13 cites·7 claims
- 3668US11545441B2Semiconductor package having wafer-level active die and external die mountINTEL CORP·Filed 2020·Granted Jan 3, 2023·0 cites·16 claims
- 3764US10541190B2Stacked die package with through-mold thermally conductive structures between a bottom die and a thermally conductive materialINTEL CORP·Filed 2015·Granted Jan 21, 2020·1 cites·15 claims
- 3864US2021391281A1Warpage control for microelectronics packagesINTEL CORP·Filed 2021·Application pending·0 cites
- 3963US2020286834A1Ultra small molded module integrated with die by module-on-wafer assemblyINTEL CORP·Filed 2020·Application pending·0 cites
- 4059US10790231B2Microelectronic structures having multiple microelectronic devices connected with a microelectronic bridge embedded in a microelectronic substrateINTEL CORP·Filed 2019·Granted Sep 29, 2020·0 cites·22 claims
- 4158US11114388B2Warpage control for microelectronics packagesINTEL CORP·Filed 2019·Granted Sep 7, 2021·0 cites·19 claims
- 4258US10615128B2Systems and methods for electromagnetic interference shieldingINTEL CORP·Filed 2018·Granted Apr 7, 2020·0 cites·17 claims
- 4357US10256205B2Variable ball height on ball grid array packages by solder paste transferINTEL CORP·Filed 2017·Granted Apr 9, 2019·0 cites·5 claims
- 4457US8426250B2Laser-assisted chemical singulation of a waferVAKANAS GEORGE·Filed 2008·Granted Apr 23, 2013·1 cites·19 claims
- 4556US11089689B2Fine feature formation techniques for printed circuit boardsINTEL CORP·Filed 2016·Granted Aug 10, 2021·0 cites·25 claims
- 4655US10910317B2Semiconductor package having wafer-level active die and external die mountINTEL CORP·Filed 2016·Granted Feb 2, 2021·0 cites·20 claims
- 4754US10325866B2Electronic device packages with conformal EMI shielding and related methodsINTEL CORP·Filed 2017·Granted Jun 18, 2019·0 cites·14 claims
- 4854US9607964B2Method and materials for warpage thermal and interconnect solutionsKARHADE OMKAR G·Filed 2014·Granted Mar 28, 2017·0 cites·10 claims
- 4954US9123732B2Die warpage control for thin die assemblySANE SANDEEP B·Filed 2012·Granted Sep 1, 2015·1 cites·16 claims
- 5053US10224223B2Low temperature thin wafer backside vacuum process with backgrinding tapeINTEL CORP·Filed 2016·Granted Mar 5, 2019·0 cites·3 claims
Showing the top 50 of 60 patent records by PatentIndex Score.
Join the waitlist — get patent alerts
Get an alert when Eric J. Li files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →