Inventor · disambiguated record
Eric C. Peterson
Also filed as: PETERSON ERIC · PETERSON ERIC C · PETERSON ERIC CLARENCE
148 granted patents·46 pending applications·1,718 citations·filing 1993–2024
99Inventor score
Files withMICROSOFT TECHNOLOGY LICENSING LLC74HEWLETT PACKARD DEVELOPMENT CO54MICROSOFT CORP15PETERSON ERIC C10CARRIER CORP7
Top patents by PatentIndex Score
194 records- 0198US7197806B2Fastener for variable mountingHEWLETT PACKARD DEVELOPMENT CO·Filed 2005·Granted Apr 3, 2007·82 cites·8 claims
- 0297US11792962B2Systems and methods for immersion-cooled datacentersMICROSOFT TECHNOLOGY LICENSING LLC·Filed 2021·Granted Oct 17, 2023·7 cites·20 claims
- 0397US11729948B2Immersion cooling system that enables increased heat flux at heat-generating components of computing devicesMICROSOFT TECHNOLOGY LICENSING LLC·Filed 2021·Granted Aug 15, 2023·6 cites·20 claims
- 0497US11533829B2Systems and methods for immersion-cooled datacentersMICROSOFT TECHNOLOGY LICENSING LLC·Filed 2021·Granted Dec 20, 2022·6 cites·20 claims
- 0597US10765033B1Immersion cooling enclosures with insulating linersMICROSOFT TECHNOLOGY LICENSING LLC·Filed 2019·Granted Sep 1, 2020·36 cites·20 claims
- 0697US7791889B2Redundant power beneath circuit boardHEWLETT PACKARD DEVELOPMENT CO·Filed 2005·Granted Sep 7, 2010·118 cites·12 claims
- 0796US12189441B23-D structured two-phase microfluidic cooling with nano structured boiling enhancement coatingMICROSOFT TECHNOLOGY LICENSING LLC·Filed 2022·Granted Jan 7, 2025·5 cites·15 claims
- 0896US11997827B2Immersion cooling system that enables increased heat flux at heat-generating components of computing devicesMICROSOFT TECHNOLOGY LICENSING LLC·Filed 2023·Granted May 28, 2024·4 cites·20 claims
- 0996US11903166B2Systems and methods for immersion cooling with subcooled sprayMICROSOFT TECHNOLOGY LICENSING LLC·Filed 2021·Granted Feb 13, 2024·5 cites·20 claims
- 1096US11606878B2Systems and methods for immersion-cooled datacentersMICROSOFT TECHNOLOGY LICENSING LLC·Filed 2021·Granted Mar 14, 2023·4 cites·20 claims
- 1196US8599557B2Printed circuit board cooling assemblyPETERSON ERIC C·Filed 2009·Granted Dec 3, 2013·49 cites·12 claims
- 1296US7929310B2Cell board interconnection architectureHEWLETT PACKARD DEVELOPMENT CO·Filed 2010·Granted Apr 19, 2011·21 cites·16 claims
- 1396US6540531B2Clamp system for high speed cable terminationHEWLETT PACKARD DEVELOPMENT CO·Filed 2001·Granted Apr 1, 2003·159 cites·17 claims
- 1495US11910567B2Systems and methods for immersion-cooled datacentersMICROSOFT TECHNOLOGY LICENSING LLC·Filed 2023·Granted Feb 20, 2024·2 cites·20 claims
- 1595US10199669B2Power modulation for fuel cell powered datacentersMICROSOFT TECHNOLOGY LICENSING LLC·Filed 2016·Granted Feb 5, 2019·8 cites·20 claims
- 1695US10033210B2Power supply for use with a slow-response power sourceMICROSOFT CORP·Filed 2014·Granted Jul 24, 2018·36 cites·21 claims
- 1795US8384244B2Rack-based uninterruptible power supplyMICROSOFT CORP·Filed 2010·Granted Feb 26, 2013·32 cites·18 claims
- 1895US7855888B2Cooling manifold assemblyHEWLETT PACKARD DEVELOPMENT CO·Filed 2009·Granted Dec 21, 2010·38 cites·15 claims
- 1995US7382613B2Computer system with external air moverHEWLETT PACKARD DEVELOPMENT CO·Filed 2005·Granted Jun 3, 2008·46 cites·23 claims
- 2094US7821792B2Cell board interconnection architectureHEWLETT PACKARD DEVELOPMENT CO·Filed 2007·Granted Oct 26, 2010·32 cites·9 claims
- 2194US7499281B2Multi-chip module with power systemHEWLETT PACKARD DEVELOPMENT CO·Filed 2008·Granted Mar 3, 2009·35 cites·8 claims
- 2294US7360104B2Redundant voltage distribution system and method for a memory module having multiple external voltagesHEWLETT PACKARD DEVELOPMENT CO·Filed 2005·Granted Apr 15, 2008·29 cites·35 claims
- 2393US9844167B2Underwater container cooling via external heat exchangerMICROSOFT TECHNOLOGY LICENSING LLC·Filed 2015·Granted Dec 12, 2017·9 cites·23 claims
- 2492US12108568B2Systems and methods for thermal management of high-capacity devices in immersion-cooled datacentersMICROSOFT TECHNOLOGY LICENSING LLC·Filed 2021·Granted Oct 1, 2024·2 cites·20 claims
- 2591US8749986B1Flexible midplane and architecture for a multi-processor computer systemPETERSON ERIC C·Filed 2005·Granted Jun 10, 2014·22 cites·20 claims
- 2691US8582302B2Modular equipment rack system for data centerPETERSON ERIC C·Filed 2011·Granted Nov 12, 2013·14 cites·20 claims
- 2790US12004328B2Systems and methods for immersion-cooled datacentersMICROSOFT TECHNOLOGY LICENSING LLC·Filed 2021·Granted Jun 4, 2024·2 cites·20 claims
- 2890US8542488B2Cooling apparatus for an ICPETERSON ERIC C·Filed 2009·Granted Sep 24, 2013·20 cites·9 claims
- 2990US7403396B2Communicating with an electronic module that is slidably mounted in a systemHEWLETT PACKARD DEVELOPMENT CO·Filed 2005·Granted Jul 22, 2008·17 cites·15 claims
- 3090US7379297B2Air flow regulation devicesHEWLETT PACKARD DEVELOPMENT CO·Filed 2006·Granted May 27, 2008·19 cites·18 claims
- 3190US6634890B2Spring-loaded heat sink assembly for a circuit assemblyHEWLETT PACKARD DEVELOPMENT CO·Filed 2001·Granted Oct 21, 2003·40 cites·10 claims
- 3289US8868954B1Low cost storage for rarely read dataMICROSOFT CORP·Filed 2013·Granted Oct 21, 2014·14 cites·20 claims
- 3389US7068515B2Multi-chip module with stacked redundant powerHEWLETT PACKARD DEVELOPMENT CO·Filed 2004·Granted Jun 27, 2006·46 cites·20 claims
- 3488US8487473B2Hierarchical power smoothingPETERSON ERIC C·Filed 2010·Granted Jul 16, 2013·15 cites·20 claims
- 3588US8488323B2Controlling minimum air inlet temperature using waste heatPETERSON ERIC C·Filed 2010·Granted Jul 16, 2013·12 cites·20 claims
- 3687US11726286B2Fiber optic cable connector and adapter housingMICROSOFT TECHNOLOGY LICENSING LLC·Filed 2021·Granted Aug 15, 2023·2 cites·20 claims
- 3787US9608284B2Dynamically controlled heat exchange for cascading startup of fuel cell gridsMICROSOFT TECHNOLOGY LICENSING LLC·Filed 2014·Granted Mar 28, 2017·4 cites·20 claims
- 3887US8952566B2Chassis slots accepting battery modules and other module typesHARRIS SHAUN L·Filed 2010·Granted Feb 10, 2015·11 cites·20 claims
- 3987US7345885B2Heat spreader with multiple stacked printed circuit boardsHEWLETT PACKARD DEVELOPMENT CO·Filed 2004·Granted Mar 18, 2008·38 cites·18 claims
- 4087US2025176138A1Systems and methods for immersion-cooled datacentersMICROSOFT TECHNOLOGY LICENSING LLC·Filed 2024·Application pending·0 cites
- 4186US10719773B2Managing computational workloads of computing apparatuses powered by renewable resourcesMICROSOFT TECHNOLOGY LICENSING LLC·Filed 2016·Granted Jul 21, 2020·5 cites·20 claims
- 4286US7336490B2Multi-chip module with power systemHEWLETT PACKARD DEVELOPMENT CO·Filed 2004·Granted Feb 26, 2008·38 cites·11 claims
- 4385US11991858B2Two phase coolant managementMICROSOFT TECHNOLOGY LICENSING LLC·Filed 2021·Granted May 21, 2024·1 cites·20 claims
- 4484US12389568B2Immersion cooling system that enables increased heat flux at heat-generating components of computing devicesMICROSOFT TECHNOLOGY LICENSING LLC·Filed 2024·Granted Aug 12, 2025·0 cites·20 claims
- 4584US12219736B2Systems and methods for immersion-cooled datacentersMICROSOFT TECHNOLOGY LICENSING LLC·Filed 2024·Granted Feb 4, 2025·0 cites·20 claims
- 4684US7647787B2Upgradeable, modular data center cooling apparatusHEWLETT PACKARD DEVELOPMENT CO·Filed 2004·Granted Jan 19, 2010·41 cites·22 claims
- 4783US11990653B2Fuel cell deployment systems and apparatusMICROSOFT TECHNOLOGY LICENSING LLC·Filed 2022·Granted May 21, 2024·0 cites·20 claims
- 4883US11799105B2Fuel cell deployment systems and apparatusMICROSOFT TECHNOLOGY LICENSING LLC·Filed 2022·Granted Oct 24, 2023·0 cites·20 claims
- 4983US6746270B2Spring-loaded heat sink assembly for a circuit assemblyHEWLETT PACKARD DEVELOPMENT CO·Filed 2003·Granted Jun 8, 2004·23 cites·8 claims
- 5082US12382612B2Mitigating vapor loss in a two-phase immersion cooling systemMICROSOFT TECHNOLOGY LICENSING LLC·Filed 2023·Granted Aug 5, 2025·0 cites·20 claims
Showing the top 50 of 194 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →