Inventor · disambiguated record
Eric F. Richardson
Also filed as: RICHARDSON ERIC F · RICHARDSON ERIC FRANKLYN
3 granted patents·33 citations·filing 1990–1999
69Inventor score
Technology areasH10W
Top patents by PatentIndex Score
3 records- 0148US5175611AMicrowave integrated circuit package to eliminate alumina substrate crackingWATKINS JOHNSON CO·Filed 1991·Granted Dec 29, 1992·19 cites·9 claims
- 0237US5102029AMicrowave integrated circuit package to eliminate alumina substrate cracking and methodWATKINS JOHNSON CO·Filed 1990·Granted Apr 7, 1992·11 cites·9 claims
- 0324US6288909B1Conductive via feed through for double-sided modulesSTELLEX MICROWAVE SYSTEMS INC·Filed 1999·Granted Sep 11, 2001·3 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →