Inventor · disambiguated record
Eric Saugier
Also filed as: SAUGIER ERIC
15 granted patents·5 pending applications·41 citations·filing 2006–2023
89Inventor score
Files withST MICROELECTRONICS GRENOBLE 28ST MICROELECTRONICS SA2STMICROELECTRONICS (GRENOBLE 2) SAS2CAMPBELL COLIN1FINDLAY EWAN1
Top patents by PatentIndex Score
20 records- 0193US11688815B2Method for manufacturing a cover for an electronic package and electronic package comprising a coverST MICROELECTRONICS GRENOBLE 2·Filed 2020·Granted Jun 27, 2023·4 cites·22 claims
- 0289US8928893B2Proximity sensorFINDLAY EWAN·Filed 2011·Granted Jan 6, 2015·19 cites·35 claims
- 0378US9105766B2Optical electronic packageST MICROELECTRONICS GRENOBLE 2·Filed 2013·Granted Aug 11, 2015·6 cites·17 claims
- 0472US7880132B2Cap including a housing and optically transparent member to protect a camera module lensST MICROELECTRONICS RES & DEV·Filed 2007·Granted Feb 1, 2011·5 cites·29 claims
- 0566US7393215B2Assembly of a mobile objective above an optical sensorST MICROELECTRONICS SA·Filed 2006·Granted Jul 1, 2008·1 cites·24 claims
- 0664US8586450B2Process for fabricating semiconductor devices and a semiconductor device comprising a chip with through-viasSAUGIER ERIC·Filed 2011·Granted Nov 19, 2013·3 cites·24 claims
- 0758US10833208B2Method for manufacturing a cover for an electronic package and electronic package comprising a coverST MICROELECTRONICS GRENOBLE 2·Filed 2019·Granted Nov 10, 2020·0 cites·12 claims
- 0858US2025002333A1Wafer level proximity sensor and method of making sameST MICROELECTRONICS INT NV·Filed 2023·Application pending·0 cites
- 0956US9006904B2Dual side package on packageST MICROELECTRONICS GRENOBLE 2·Filed 2012·Granted Apr 14, 2015·1 cites·12 claims
- 1055US8098445B2Focussing apparatusCAMPBELL COLIN·Filed 2008·Granted Jan 17, 2012·1 cites·20 claims
- 1152US10483408B2Method for making a cover for an electronic package and electronic package comprising a coverST MICROELECTRONICS GRENOBLE 2·Filed 2017·Granted Nov 19, 2019·0 cites·31 claims
- 1251US10978400B2Conductive viasST MICROELECTRONICS GRENOBLE 2·Filed 2019·Granted Apr 13, 2021·0 cites·20 claims
- 1347US10955289B2Electronic module including an ambient light sensor stacked over a proximity sensorST MICROELECTRONICS RES & DEV LTD·Filed 2019·Granted Mar 23, 2021·0 cites·24 claims
- 1447US7668449B2Barrel of variable focal length lensST MICROELECTRONICS SA·Filed 2006·Granted Feb 23, 2010·1 cites·21 claims
- 1542US2023223277A1Chip carrierST MICROELECTRONICS GRENOBLE 2·Filed 2023·Application pending·0 cites
- 1641US10811349B2Electronic device including at least one electronic chip and electronic packageST MICROELECTRONICS GRENOBLE 2·Filed 2018·Granted Oct 20, 2020·0 cites·19 claims
- 1739US9525094B2Proximity and ranging sensorST MICROELECTRONICS PTE LTD·Filed 2015·Granted Dec 20, 2016·0 cites·20 claims
- 1835US2017256514A1Optical electronic device and method of fabricationSTMICROELECTRONICS (GRENOBLE 2) SAS·Filed 2016·Application pending·0 cites
- 1935US2017345796A1Electronic device with stacked electronic chipsSTMICROELECTRONICS (GRENOBLE 2) SAS·Filed 2016·Application pending·0 cites
- 2034US2014057394A1Method for making a double-sided fanout semiconductor package with embedded surface mount devices, and product madeRAMASAMY ANANDAN·Filed 2012·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →