Inventor · disambiguated record
Eric F. Schulte
Also filed as: SCHULTE ERIC · SCHULTE ERIC F · SCHULTE ERIC FRANK
31 granted patents·11 pending applications·637 citations·filing 1980–2020
97Inventor score
Files withSET NORTH AMERICA LLC14SANTA BARBARA RES CENTER8TEXAS INSTRUMENTS INC6ONTOS EQUIPMENT SYSTEMS INC5MARKUNAS JUSTIN K2
Top patents by PatentIndex Score
42 records- 0195US5113076ATwo terminal multi-band infrared radiation detectorSANTA BARBARA RES CENTER·Filed 1989·Granted May 12, 1992·121 cites·22 claims
- 0294US4783594AReticular detector arraySANTA BARBARA RES CENTER·Filed 1987·Granted Nov 8, 1988·101 cites·19 claims
- 0390US11134598B23D packaging with low-force thermocompression bonding of oxidizable materialsSET NORTH AMERICA LLC·Filed 2013·Granted Sep 28, 2021·6 cites·15 claims
- 0483US5880510AGraded layer passivation of group II-VI infrared photodetectorsRAYTHEON CO·Filed 1988·Granted Mar 9, 1999·46 cites·44 claims
- 0583US4865245AOxide removal from metallic contact bumps formed on semiconductor devices to improve hybridization cold-weldsSANTA BARBARA RES CENTER·Filed 1987·Granted Sep 12, 1989·70 cites·19 claims
- 0679US8567658B2Method of plasma preparation of metallic contacts to enhance mechanical and electrical integrity of subsequent interconnect bondsSCHULTE ERIC FRANK·Filed 2010·Granted Oct 29, 2013·6 cites·17 claims
- 0779US4447291AMethod for via formation in HgCdTeTEXAS INSTRUMENTS INC·Filed 1983·Granted May 8, 1984·61 cites·6 claims
- 0878US4970567AMethod and apparatus for detecting infrared radiationSANTA BARBARA RES CENTER·Filed 1989·Granted Nov 13, 1990·37 cites·12 claims
- 0976US4369498APhotoluminescent powered calculatorTEXAS INSTRUMENTS INC·Filed 1981·Granted Jan 18, 1983·31 cites·8 claims
- 1075US12363877B2Thermocompression bonding with passivated gold contacting metalSET NORTH AMERICA LLC·Filed 2020·Granted Jul 15, 2025·0 cites·18 claims
- 1175US12363878B2Thermocompression bonding with passivated silver-based contacting metalSET NORTH AMERICA LLC·Filed 2020·Granted Jul 15, 2025·0 cites·3 claims
- 1275US12356553B2Thermocompression bonding with passivated tin-based contacting metalSET NORTH AMERICA LLC·Filed 2020·Granted Jul 8, 2025·0 cites·17 claims
- 1375US12245381B2Thermocompression bonding with passivated nickel-based contacting metalSET NORTH AMERICA LLC·Filed 2020·Granted Mar 4, 2025·0 cites·3 claims
- 1475US12245380B2Thermocompression bonding with passivated copper-based contacting metalSET NORTH AMERICA LLC·Filed 2020·Granted Mar 4, 2025·0 cites·11 claims
- 1575US12245379B2Thermocompression bonding using metastable gas atomsSET NORTH AMERICA LLC·Filed 2020·Granted Mar 4, 2025·0 cites·22 claims
- 1674US4388517ASublimation patterning processTEXAS INSTRUMENTS INC·Filed 1980·Granted Jun 14, 1983·36 cites·4 claims
- 1769US4956304ABuried junction infrared photodetector processSANTA BARBARA RES CENTER·Filed 1988·Granted Sep 11, 1990·25 cites·30 claims
- 1866US7723815B1Wafer bonded composite structure for thermally matching a readout circuit (ROIC) and an infrared detector chip both during and after hybridizationRAYTHEON CO·Filed 2004·Granted May 25, 2010·14 cites·12 claims
- 1965US8456004B2Template wafer and process for small pitch flip-chip interconnect hybridizationMARKUNAS JUSTIN K·Filed 2012·Granted Jun 4, 2013·2 cites·3 claims
- 2062US2018132397A1Thermocompression Bonding with Passivated Gold Contacting MetalSET NORTH AMERICA LLC·Filed 2017·Application pending·0 cites
- 2162US2018132395A1Thermocompression Bonding with Passivated Indium-Based Contacting MetalSET NORTH AMERICA LLC·Filed 2017·Application pending·0 cites
- 2262US2018132399A1Thermocompression Bonding with Passivated Nickel-Based Contacting MetalSET NORTH AMERICA LLC·Filed 2017·Application pending·0 cites
- 2362US2018132394A1Thermocompression Bonding Using Metastable Gas AtomsSET NORTH AMERICA LLC·Filed 2017·Application pending·0 cites
- 2462US2018132398A1Thermocompression Bonding with Passivated Silver-Based Contacting MetalSET NORTH AMERICA LLC·Filed 2017·Application pending·0 cites
- 2562US2018132393A1System for Low-Force Thermocompression BondingSET NORTH AMERICA LLC·Filed 2017·Application pending·0 cites
- 2662US2018132396A1Thermocompression Bonding with Passivated Copper-Based Contacting MetalSET NORTH AMERICA LLC·Filed 2017·Application pending·0 cites
- 2761US8592301B2Template wafer fabrication process for small pitch flip-chip interconnect hybridizationUS ARMY·Filed 2013·Granted Nov 26, 2013·1 cites·9 claims
- 2854US10985024B2Simultaneous hydrophilization of photoresist and metal surface preparation: methods, systems, and productsONTOS EQUIPMENT SYSTEMS·Filed 2019·Granted Apr 20, 2021·0 cites·8 claims
- 2954US8163644B2Template process for small pitch flip-chip interconnect hybridizationMARKUNAS JUSTIN K·Filed 2009·Granted Apr 24, 2012·1 cites·8 claims
- 3054US5401986ABake-stable HgCdTe photodetector with II-VI passivation layerSANTA BARBARA RES CENTER·Filed 1994·Granted Mar 28, 1995·16 cites·16 claims
- 3153US4413020ADevice fabrication incorporating liquid assisted laser patterning of metallizationTEXAS INSTRUMENTS INC·Filed 1982·Granted Nov 1, 1983·20 cites·7 claims
- 3250US9909232B2Epitaxial growth using atmospheric plasma preparation stepsONTOS EQUIPMENT SYSTEMS INC·Filed 2016·Granted Mar 6, 2018·0 cites·13 claims
- 3350US2008217717A1Cte matched multiplexorLOCKHEED CORP·Filed 2008·Application pending·0 cites
- 3449US2019062944A1Epitaxial Growth Using Atmospheric Plasma Preparation StepsONTOS EQUIPMENT SYSTEMS INC·Filed 2018·Application pending·0 cites
- 3548US2014102594A1Method of plasma preparation of metallic contacts to enhance mechanical and electrical integrity of subsequent interconnect bondsONTOS EQUIPMENT SYSTEMS INC·Filed 2013·Application pending·0 cites
- 3647US5646426AContact metal diffusion barrier for semiconductor devicesSANTA BARBARA RES CENTER·Filed 1995·Granted Jul 8, 1997·14 cites·13 claims
- 3743US10438804B2Simultaneous hydrophilization of photoresist and metal surface preparation: methods, systems, and productsONTOS EQUIPMENT SYSTEMS·Filed 2015·Granted Oct 8, 2019·0 cites·16 claims
- 3843US5296384ABake-stable HgCdTe photodetector and method for fabricating sameSANTA BARBARA RES CENTER·Filed 1992·Granted Mar 22, 1994·15 cites·11 claims
- 3941US4729003AConfiguration of a metal insulator semiconductor with a processor based gateTEXAS INSTRUMENTS INC·Filed 1986·Granted Mar 1, 1988·7 cites·20 claims
- 4040US4616403AConfiguration of a metal insulator semiconductor with a processor based gateTEXAS INSTRUMENTS INC·Filed 1984·Granted Oct 14, 1986·7 cites·12 claims
- 4134US10672594B2System and method for plasma head thermal controlONTOS EQUIPMENT SYSTEMS INC·Filed 2017·Granted Jun 2, 2020·0 cites·20 claims
- 4226US2019088451A1Integrated Thermal Management for Surface Treatment with Atmospheric PlasmaONTOS EQUIPMENT SYSTEMS INC·Filed 2018·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Eric F. Schulte files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →