Inventor · disambiguated record
Erick Merle Spory
Also filed as: SPORY ERICK · SPORY ERICK MERLE
19 granted patents·1 pending application·27 citations·filing 2008–2022
91Inventor score
Files withSPORY ERICK MERLE13GLOBAL CIRCUIT INNOVATIONS INC3GLOBAL CIRCUIT INNOVATIONS INCORPORATED3SPORY ERICK1
Top patents by PatentIndex Score
20 records- 0189US9870968B2Repackaged integrated circuit and assembly methodSPORY ERICK MERLE·Filed 2016·Granted Jan 16, 2018·9 cites·12 claims
- 0278US10654259B2Conductive diamond application methodSPORY ERICK MERLE·Filed 2017·Granted May 19, 2020·1 cites·10 claims
- 0375US10460326B2Counterfeit integrated circuit detection by comparing integrated circuit signature to reference signatureSPORY ERICK MERLE·Filed 2017·Granted Oct 29, 2019·2 cites·16 claims
- 0474US10002846B2Method for remapping a packaged extracted die with 3D printed bond connectionsSPORY ERICK MERLE·Filed 2017·Granted Jun 19, 2018·2 cites·20 claims
- 0573US9935028B2Method and apparatus for printing integrated circuit bond connectionsGLOBAL CIRCUIT INNOVATIONS INCORPORATED·Filed 2013·Granted Apr 3, 2018·3 cites·18 claims
- 0672US11978711B2Solder ball application for singular dieGLOBAL CIRCUIT INNOVATIONS INC·Filed 2022·Granted May 7, 2024·0 cites·12 claims
- 0771US9824948B2Integrated circuit with printed bond connectionsGLOBAL CIRCUIT INNOVATIONS INCORPORATED·Filed 2015·Granted Nov 21, 2017·2 cites·10 claims
- 0870US10431510B2Hermetic lid seal printing methodSPORY ERICK MERLE·Filed 2018·Granted Oct 1, 2019·1 cites·20 claims
- 0967US10115645B1Repackaged reconditioned die method and assemblySPORY ERICK MERLE·Filed 2018·Granted Oct 30, 2018·1 cites·20 claims
- 1064US11508680B2Solder ball application for singular dieGLOBAL CIRCUIT INNOVATIONS INC·Filed 2020·Granted Nov 22, 2022·0 cites·7 claims
- 1164US11077654B2Conductive diamond application systemGLOBAL CIRCUIT INNOVATIONS INC·Filed 2020·Granted Aug 3, 2021·0 cites·10 claims
- 1264US8466371B2Printed circuit board interconnecting structure with compliant cantilever interposersSPORY ERICK·Filed 2008·Granted Jun 18, 2013·4 cites·9 claims
- 1362US9966319B1Environmental hardening integrated circuit method and apparatusSPORY ERICK MERLE·Filed 2013·Granted May 8, 2018·1 cites·9 claims
- 1461US9711480B2Environmental hardened packaged integrated circuitGLOBAL CIRCUIT INNOVATIONS INCORPORATED·Filed 2015·Granted Jul 18, 2017·1 cites·10 claims
- 1552US2020020602A1Hermetic lid seal printing methodSPORY ERICK MERLE·Filed 2019·Application pending·0 cites
- 1649US10177056B2Repackaged integrated circuit assembly methodSPORY ERICK MERLE·Filed 2017·Granted Jan 8, 2019·0 cites·20 claims
- 1746US10177054B2Method for remapping a packaged extracted dieSPORY ERICK MERLE·Filed 2017·Granted Jan 8, 2019·0 cites·20 claims
- 1846US10109606B2Remapped packaged extracted dieSPORY ERICK MERLE·Filed 2017·Granted Oct 23, 2018·0 cites·20 claims
- 1944US10147660B2Remapped packaged extracted die with 3D printed bond connectionsSPORY ERICK MERLE·Filed 2017·Granted Dec 4, 2018·0 cites·19 claims
- 2044US10128161B23D printed hermetic package assembly and methodSPORY ERICK MERLE·Filed 2017·Granted Nov 13, 2018·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →