Inventor · disambiguated record
Eric Tosaya
Also filed as: TOSAYA ERIC · TOSAYA ERIC S
18 granted patents·5 pending applications·313 citations·filing 1987–2017
95Inventor score
Top patents by PatentIndex Score
23 records- 0188US9496154B2Use of underfill tape in microelectronic components, and microelectronic components with cavities coupled to through-substrate viasINVENSAS CORP·Filed 2014·Granted Nov 15, 2016·9 cites·15 claims
- 0288US7243327B1Method for automatically routing connections between top side conductors and bottom side conductors of an integrated circuit packageCISCO TECH INC·Filed 2005·Granted Jul 10, 2007·24 cites·13 claims
- 0388US5304743AMultilayer IC semiconductor packageLSI LOGIC CORP·Filed 1992·Granted Apr 19, 1994·84 cites·7 claims
- 0487US8405187B2Chip package with channel stiffener frameTOSAYA ERIC·Filed 2011·Granted Mar 26, 2013·12 cites·20 claims
- 0584US6512675B1Heat sink grounded to a grounded package lidADVANCED MICRO DEVICES INC·Filed 2001·Granted Jan 28, 2003·43 cites·12 claims
- 0680US6538320B1Heat spreader having holes for rivet-like adhesive connectionsADVANCED MICRO DEVICES INC·Filed 2001·Granted Mar 25, 2003·31 cites·16 claims
- 0777US5414222AMultilayer IC semiconductor packageLSI LOGIC CORP·Filed 1993·Granted May 9, 1995·48 cites·4 claims
- 0871US8008133B2Chip package with channel stiffener frameGLOBALFOUNDRIES INC·Filed 2008·Granted Aug 30, 2011·4 cites·21 claims
- 0963US9524883B2Holding of interposers and other microelectronic workpieces in position during assembly and other processingINVENSAS CORP·Filed 2014·Granted Dec 20, 2016·1 cites·19 claims
- 1063US6483169B1Extruded heat spreaderADVANCED MICRO DEVICES INC·Filed 2001·Granted Nov 19, 2002·12 cites·15 claims
- 1158US6399474B1Method and apparatus for precoining BGA type packages prior to electrical characterizationADVANCED MICRO DEVICES INC·Filed 2001·Granted Jun 4, 2002·7 cites·5 claims
- 1257US9620436B2Light emitting diode device with reconstituted LED components on substrateINVENSAS CORP·Filed 2014·Granted Apr 11, 2017·0 cites·17 claims
- 1357US6976236B1Method for automatically routing connections between top side conductors and bottom side conductors of an integrated circuit packagePROCKET NETWORKS INC·Filed 2002·Granted Dec 13, 2005·7 cites·13 claims
- 1456US6508845B1Method and apparatus for precoining BGA type packages prior to electrical characterizationADVANCED MICRO DEVICES INC·Filed 2002·Granted Jan 21, 2003·6 cites·3 claims
- 1555US10008652B2Light emitting diode device with reconstituted LED components on substrateINVENSAS CORP·Filed 2017·Granted Jun 26, 2018·0 cites·17 claims
- 1650US7055122B1Method for automatically connecting top side conductors with bottom side conductors of an integrated circuit packageCISCO TECH INC·Filed 2002·Granted May 30, 2006·3 cites·27 claims
- 1748US4810671AProcess for bonding die to substrate using a gold/silicon seedINTEL CORP·Filed 1988·Granted Mar 7, 1989·15 cites·2 claims
- 1848US2009246916A1Chip Package with Pin Stabilization LayerTOSAYA ERIC·Filed 2009·Application pending·0 cites
- 1945US2008283999A1Chip Package with Pin Stabilization LayerTOSAYA ERIC·Filed 2007·Application pending·0 cites
- 2044US2013258619A1Stiffener frame with circuit board corner protectionLEY TOM J·Filed 2012·Application pending·0 cites
- 2139US2008284047A1Chip Package with Stiffener RingTOSAYA ERIC·Filed 2007·Application pending·0 cites
- 2236US4771018AProcess of attaching a die to a substrate using gold/silicon seedINTEL CORP·Filed 1987·Granted Sep 13, 1988·7 cites·3 claims
- 2335US2008186650A1Decoupling Capacitor with Controlled Equivalent Series ResistanceBEKER BENJAMIN·Filed 2007·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →