Inventor · disambiguated record
Etsu Takeuchi
Also filed as: TAKEUCHI ETSU
10 granted patents·3 pending applications·183 citations·filing 1990–2011
89Inventor score
Top patents by PatentIndex Score
13 records- 0194US7524594B2Photosensitive dielectric resin compositions, films formed therefrom and semiconductor and display devices encompassing such filmsPROMERUS LLC·Filed 2005·Granted Apr 28, 2009·29 cites·33 claims
- 0290US5449584APositive photo-sensitive resin composition comprising a photosensitive polybenzoxazole or a mixture of a polybenzoxazole, an organic solvent soluble polymer and a diazoquinone and/or a dihydropyridine compoundSUMITOMO BAKELITE CO·Filed 1994·Granted Sep 12, 1995·80 cites·11 claims
- 0379US8053515B2Directly photodefinable polymer compositions and methods thereofPROMERUS LLC·Filed 2007·Granted Nov 8, 2011·6 cites·47 claims
- 0470US7858721B2Photosensitive dielectric resin compositions, films formed therefrom and semiconductor and display devices encompassing such filmsPROMERUS LLC·Filed 2009·Granted Dec 28, 2010·1 cites·3 claims
- 0567US6528231B1Photosensitive resin composition, printed wiring board, substrate for disposing semiconductor chips, semiconductor device and processes for producing a printed wiring board, a substrate for disposing semiconductor chips and a semiconductor deviceRIKEN·Filed 2000·Granted Mar 4, 2003·8 cites·12 claims
- 0666US5385808APhotosensitive resin composition and semiconductor apparatus using itSUMITOMO BAKELITE CO·Filed 1993·Granted Jan 31, 1995·21 cites·53 claims
- 0757US5238784APhotosensitive resin composition with polyamic acid polymerSUMITOMO BAKELITE CO·Filed 1990·Granted Aug 24, 1993·20 cites·17 claims
- 0845US5507903AProcess for producing two-layered tape for tabSUMITOMO BAKELITE CO·Filed 1992·Granted Apr 16, 1996·18 cites·15 claims
- 0941US6709804B2Printed wiring board and semiconductor device and processes to prepare the sameRIKEN·Filed 2003·Granted Mar 23, 2004·0 cites·42 claims
- 1035US2013009172A1Method of manufacture of light-emitting element and light-emitting element manufactured therebySUMITOMO BAKELITE CO·Filed 2011·Application pending·0 cites
- 1132US2012228782A1Method for manufacturing electronic device, electronic device, method for manufacturing electronic device package and electronic device packageKAWATA MASAKAZU·Filed 2010·Application pending·0 cites
- 1230US2011263095A1Temporary bonding adhesive for a semiconductor wafer and method for manufacturing a semiconductor device using the sameSUMITOMO BAKELITE CO·Filed 2010·Application pending·0 cites
- 1327US9399725B2Temporary bonding adhesive for a semiconductor wafer and method for manufacturing a semiconductor device using the sameTAKEUCHI ETSU·Filed 2010·Granted Jul 26, 2016·0 cites·23 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →