Inventor · disambiguated record
Etsuo Yamada
Also filed as: YAMADA ETSUO
17 granted patents·443 citations·filing 1988–2009
94Inventor score
Top patents by PatentIndex Score
17 records- 0195US6208021B1Semiconductor device, manufacturing method thereof and aggregate type semiconductor deviceOKI ELECTRIC IND CO LTD·Filed 1997·Granted Mar 27, 2001·187 cites·20 claims
- 0288US6262482B1Semiconductor deviceOKI ELECTRIC IND CO LTD·Filed 1998·Granted Jul 17, 2001·104 cites·24 claims
- 0385US7110498B2Image reading apparatus and X-ray imaging apparatusCANON KK·Filed 2004·Granted Sep 19, 2006·29 cites·11 claims
- 0483US6403398B2Semiconductor device, manufacturing method thereof and aggregate type semiconductor deviceOKI ELECTRIC IND CO LTD·Filed 2000·Granted Jun 11, 2002·30 cites·7 claims
- 0574US8280665B2Calibration device for on-vehicle cameraNAKAMURA YOSHIHIRO·Filed 2009·Granted Oct 2, 2012·7 cites·12 claims
- 0665US4967417ALaser driving device provided with two reference signal sources, and optical information recording apparatus using the same deviceCANON KK·Filed 1989·Granted Oct 30, 1990·15 cites·5 claims
- 0756US4982394AOptical information recording/reproducing apparatusCANON KK·Filed 1988·Granted Jan 1, 1991·10 cites·12 claims
- 0854US8077199B2Target position identifying apparatusNAKAMURA YOSHIHIRO·Filed 2009·Granted Dec 13, 2011·2 cites·11 claims
- 0952US5138596AOptical information recording apparatus including means for delaying servo gain by a predetermined timeCANON KK·Filed 1991·Granted Aug 11, 1992·9 cites·16 claims
- 1050US7402502B2Method of manufacturing a semiconductor device by using a matrix frameOKI ELECTRIC IND CO LTD·Filed 2004·Granted Jul 22, 2008·4 cites·3 claims
- 1145US6258621B1Method of fabricating a semiconductor device having insulating tape interposed between chip and chip supportOKI ELECTRIC IND CO LTD·Filed 1999·Granted Jul 10, 2001·10 cites·28 claims
- 1245US5874783ASemiconductor device having the inner end of connector leads displaced onto the surface of semiconductor chipOKI ELECTRIC IND CO LTD·Filed 1997·Granted Feb 23, 1999·13 cites·17 claims
- 1344US6913951B2Method of making a lead-on-chip deviceOKI ELECTRIC IND CO LTD·Filed 2003·Granted Jul 5, 2005·1 cites·7 claims
- 1444US6534845B1Semiconductor deviceOKI ELECTRIC IND CO LTD·Filed 1999·Granted Mar 18, 2003·10 cites·22 claims
- 1542US6002181AStructure of resin molded type semiconductor device with embedded thermal dissipatorOKI ELECTRIC IND CO LTD·Filed 1995·Granted Dec 14, 1999·11 cites·12 claims
- 1631US6097083ASemiconductor device which is crack resistantOKI ELECTRIC IND CO LTD·Filed 1997·Granted Aug 1, 2000·1 cites·4 claims
- 1730US5969410ASemiconductor IC device having chip support element and electrodes on the same surfaceOKI ELECTRIC IND CO LTD·Filed 1997·Granted Oct 19, 1999·0 cites·11 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →