Inventor · disambiguated record
Eun Hyuk Chae
Also filed as: CHAE EUN HYUK
20 granted patents·7 pending applications·44 citations·filing 2010–2017
92Inventor score
Top patents by PatentIndex Score
27 records- 0197US10347421B2Multilayer ceramic electronic component and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2017·Granted Jul 9, 2019·8 cites·20 claims
- 0293US9974183B2Multilayer ceramic electronic component and board having the sameSAMSUNG ELECTRO MECH·Filed 2017·Granted May 15, 2018·10 cites·11 claims
- 0390US9370102B2Embedded multilayer ceramic electronic component and printed circuit board having embedded multilayer ceramic electronic componentSAMSUNG ELECTRO MECH·Filed 2013·Granted Jun 14, 2016·8 cites·16 claims
- 0476US8937801B2Array-type multilayered ceramic electronic componentSAMSUNG ELECTRO MECH·Filed 2012·Granted Jan 20, 2015·2 cites·25 claims
- 0576US8902563B2Multilayer ceramic electronic componentSAMSUNG ELECTRO MECH·Filed 2012·Granted Dec 2, 2014·2 cites·16 claims
- 0675US9105411B2Multilayer ceramic capacitor and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2013·Granted Aug 11, 2015·2 cites·10 claims
- 0775US8451580B2Multilayer ceramic capacitor capable of controlling equivalent series resistanceCHUNG HAE SUK·Filed 2011·Granted May 28, 2013·3 cites·4 claims
- 0874US8953300B2Multilayer ceramic capacitor and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2013·Granted Feb 10, 2015·2 cites·8 claims
- 0971US9258896B2Multilayer ceramic capacitorSAMSUNG ELECTRO MECH·Filed 2014·Granted Feb 9, 2016·2 cites·10 claims
- 1068US9230740B2Multilayer ceramic electronic part to be embedded in board and printed circuit board having multilayer ceramic electronic part embedded thereinSAMSUNG ELECTRO MECH·Filed 2013·Granted Jan 5, 2016·1 cites·9 claims
- 1168US9099250B2Multilayer ceramic capacitor to be embedded in board, method of manufacturing the same, and method of manufacturing board having multilayer ceramic capacitor embedded thereinSAMSUNG ELECTRO MECH·Filed 2013·Granted Aug 4, 2015·1 cites·10 claims
- 1267US9424989B2Embedded multilayer ceramic electronic component and printed circuit board having the sameSAMSUNG ELECTRO MECH·Filed 2014·Granted Aug 23, 2016·1 cites·4 claims
- 1365US9226401B2Multilayer ceramic electronic part to be embedded in board and printed circuit board having multilayer ceramic electronic part embedded thereinSAMSUNG ELECTRO MECH·Filed 2013·Granted Dec 29, 2015·1 cites·18 claims
- 1464US9196421B2Multilayer ceramic electronic componentSAMSUNG ELECTRO MECH·Filed 2014·Granted Nov 24, 2015·0 cites·11 claims
- 1558US9396878B2Multilayer ceramic capacitor, manufacturing method therefor, circuit board having multilayer ceramic capacitor embedded therein, and polishing device for multilayer ceramic capacitorSAMSUNG ELECTRO MECH·Filed 2013·Granted Jul 19, 2016·1 cites·4 claims
- 1657US2013229748A1Multilayer ceramic electronic component and method of manufacturing the sameSUMSUNG ELECTRO MECHANICS CO LTD·Filed 2013·Application pending·0 cites
- 1752US9196420B2Multilayer ceramic electronic component to be embedded in board and printed circuit board having multilayer ceramic electronic component embedded thereinSAMSUNG ELECTRO MECH·Filed 2013·Granted Nov 24, 2015·0 cites·14 claims
- 1851US9287044B2Electronic component and fabrication method thereofSAMSUNG ELECTRO MECH·Filed 2013·Granted Mar 15, 2016·0 cites·16 claims
- 1950US2015016019A1Multilayer ceramic electronic component to be embedded in boardSAMSUNG ELECTRO MECH·Filed 2014·Application pending·0 cites
- 2050US2015223340A1Multilayer ceramic electronic component to be embedded in board, manufacturing method thereof, and printed circuit board having multilayer ceramic electronic componentSAMSUNG ELECTRO MECH·Filed 2014·Application pending·0 cites
- 2149US2015041197A1Embedded multilayer ceramic electronic component and printed circuit board having the sameSAMSUNG ELECTRO MECH·Filed 2014·Application pending·0 cites
- 2248US9198297B2Multilayer ceramic electronic part to be embedded in board and printed circuit board having multilayer ceramic electronic part embedded thereinSAMSUNG ELECTRO MECH·Filed 2013·Granted Nov 24, 2015·0 cites·14 claims
- 2347US9173294B2Multilayer ceramic electronic component to be embedded in board and printed circuit board having multilayer ceramic electronic component embedded thereinSAMSUNG ELECTRO MECH·Filed 2014·Granted Oct 27, 2015·0 cites·16 claims
- 2447US2015098202A1Embedded multilayer ceramic electronic component and printed circuit board having the sameSAMSUNG ELECTRO MECH·Filed 2014·Application pending·0 cites
- 2544US2012134068A1Multilayered ceramic capacitorCHAE EUN HYUK·Filed 2011·Application pending·0 cites
- 2642US2011085277A1Multilayer chip capacitorSAMSUNG ELECTRO MECH·Filed 2010·Application pending·0 cites
- 2741US8614876B2Multilayer ceramic capacitorCHUNG HAE SUK·Filed 2011·Granted Dec 24, 2013·0 cites·3 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →