Inventor · disambiguated record
Eunseok Cho
Also filed as: CHO EUNSEOK
13 granted patents·8 pending applications·98 citations·filing 2010–2024
91Inventor score
Top patents by PatentIndex Score
21 records- 0194US10198049B2Surface temperature management method of mobile device and memory thermal management method of multichip packageSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Feb 5, 2019·9 cites·18 claims
- 0293US9671141B2Thermoelectric cooling packages and thermal management methods thereofSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted Jun 6, 2017·9 cites·20 claims
- 0393US9228763B2Thermoelectric cooling packages and thermal management methods thereofKIM JAE CHOON·Filed 2012·Granted Jan 5, 2016·18 cites·13 claims
- 0490US9606591B2Surface temperature management method of mobile device and memory thermal management method of multichip packageKWON HEUNGKYU·Filed 2012·Granted Mar 28, 2017·16 cites·7 claims
- 0589US10658266B2Thermoelectric cooling packages and thermal management methods thereofSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted May 19, 2020·3 cites·15 claims
- 0686US9252031B2Semiconductor package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Feb 2, 2016·12 cites·21 claims
- 0783US8692349B2Semiconductor devices and methods of controlling temperature thereofKIM JAE CHOON·Filed 2011·Granted Apr 8, 2014·7 cites·35 claims
- 0881US8988115B2Electronic device and method for controlling temperature thereofSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Mar 24, 2015·10 cites·19 claims
- 0979US9030826B2Chip-on-film packages and device assemblies including the sameKIM JICHUL·Filed 2012·Granted May 12, 2015·6 cites·17 claims
- 1077US8269342B2Semiconductor packages including heat slugsKIM YONGHOON·Filed 2010·Granted Sep 18, 2012·6 cites·17 claims
- 1175US2025069979A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1274US12176262B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Dec 24, 2024·0 cites·16 claims
- 1372US8988645B2Display devicesKIM JICHUL·Filed 2012·Granted Mar 24, 2015·2 cites·18 claims
- 1464US11798862B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Oct 24, 2023·0 cites·19 claims
- 1563US2025125236A1Semiconductor packageSAMUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1655US2025183214A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1753US2025218969A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1846US2014184312A1Semiconductor devices and methods of controlling temperature thereofSAMSUNG ELECTRONICS CO LTD·Filed 2014·Application pending·0 cites
- 1942US2014136827A1Mobile device and data communication method of semiconductor integrated circuit of mobile deviceCHO EUNSEOK·Filed 2013·Application pending·0 cites
- 2039US2013166093A1Electronic device and temperature control method thereofKIM JAE CHOON·Filed 2012·Application pending·0 cites
- 2139US2014327129A1Package on package device and method of manufacturing the sameCHO EUNSEOK·Filed 2014·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →