Inventor · disambiguated record
Eunkyoung Choi
Also filed as: CHOI EUNKYOUNG
5 granted patents·3 pending applications·10 citations·filing 2020–2024
69Inventor score
Files withSAMSUNG ELECTRONICS CO LTD8
Top patents by PatentIndex Score
8 records- 0194US11315886B2Semiconductor package having stiffening structureSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Apr 26, 2022·7 cites·18 claims
- 0289US12027471B2Semiconductor package having stiffener structureSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Jul 2, 2024·3 cites·19 claims
- 0367US2024321776A1Semiconductor package having stiffener structureSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0464US11776918B2Semiconductor package having stiffening structureSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Oct 3, 2023·0 cites·20 claims
- 0552US2023411355A1Semiconductor package and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 0651US11664346B2Semiconductor package including semiconductor chips and dummy padSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted May 30, 2023·0 cites·20 claims
- 0750US2023066895A1Inductor and semiconductor package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Application pending·0 cites
- 0843US11557543B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jan 17, 2023·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →