Inventor · disambiguated record
Eun-Kyun Chung
Also filed as: CHUNG EUN-KYUN
1 granted patent·2 pending applications·0 citations·filing 2008–2013
10Inventor score
Technology areasH10W
Top patents by PatentIndex Score
3 records- 0132US7766212B2Spool wound with a gold alloy wire used for a bonding processHERAEUS GMBH W C·Filed 2008·Granted Aug 3, 2010·0 cites·8 claims
- 0224US2014063762A1Silver alloy wire for bonding applicationsHERAEUS MATERIALS TECH GMBH·Filed 2013·Application pending·0 cites
- 0322US2013126934A1Bonding wire for semiconductor devicesHERAEUS MATERIALS TECH GMBH·Filed 2012·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →