Inventor · disambiguated record
Eugene H. Cloud
Also filed as: CLOUD EUGENE · CLOUD EUGENE H
89 granted patents·5 pending applications·5,415 citations·filing 1988–2009
99Inventor score
Top patents by PatentIndex Score
94 records- 0199US6570248B1Structure and method for a high-performance electronic packaging assemblyMICRON TECHNOLOGY INC·Filed 2001·Granted May 27, 2003·363 cites·39 claims
- 0298US7129457B2Redundant imaging systemsMICRON TECHNOLOGY INC·Filed 2004·Granted Oct 31, 2006·137 cites·13 claims
- 0398US6756576B1Imaging system having redundant pixel groupingsMICRON TECHNOLOGY INC·Filed 2000·Granted Jun 29, 2004·178 cites·21 claims
- 0498US6356500B1Reduced power DRAM device and methodMICRON TECHNOLOGY INC·Filed 2000·Granted Mar 12, 2002·180 cites·39 claims
- 0598US6281042B1Structure and method for a high performance electronic packaging assemblyMICRON TECHNOLOGY INC·Filed 1998·Granted Aug 28, 2001·347 cites·27 claims
- 0698US5990566AHigh density semiconductor packageMICRON TECHNOLOGY INC·Filed 1998·Granted Nov 23, 1999·317 cites·22 claims
- 0797US6249460B1Dynamic flash memory cells with ultrathin tunnel oxidesMICRON TECHNOLOGY INC·Filed 2000·Granted Jun 19, 2001·144 cites·68 claims
- 0897US5110754AMethod of making a DRAM capacitor for use as an programmable antifuse for redundancy repair/options on a DRAMMICRON TECHNOLOGY INC·Filed 1991·Granted May 5, 1992·226 cites·12 claims
- 0996US6456535B2Dynamic flash memory cells with ultra thin tunnel oxidesMICRON TECHNOLOGY INC·Filed 2001·Granted Sep 24, 2002·110 cites·93 claims
- 1094US6636068B2Device and method for isolating a short-circuited integrated circuit (IC) from other ICs on a semiconductor waferMICRON TECHNOLOGY INC·Filed 2002·Granted Oct 21, 2003·40 cites·15 claims
- 1194US6521958B1MOSFET technology for programmable address decode and correctionMICRON TECHNOLOGY INC·Filed 1999·Granted Feb 18, 2003·103 cites·33 claims
- 1294US6424168B1Reduced terminal testing systemMICRON TECHNOLOGY INC·Filed 2001·Granted Jul 23, 2002·45 cites·11 claims
- 1394US5653619AMethod to form self-aligned gate structures and focus ringsMICRON TECHNOLOGY INC·Filed 1994·Granted Aug 5, 1997·80 cites·15 claims
- 1494US5324681AMethod of making a 3-dimensional programmable antifuse for integrated circuitsMICRON TECHNOLOGY INC·Filed 1993·Granted Jun 28, 1994·144 cites·11 claims
- 1593US6909635B2Programmable memory cell using charge trapping in a gate oxideMICRON TECHNOLOGY INC·Filed 2004·Granted Jun 21, 2005·54 cites·54 claims
- 1693US6534785B1Reduced terminal testing systemMICRON TECHNOLOGY INC·Filed 2000·Granted Mar 18, 2003·42 cites·3 claims
- 1793US6373740B1Transmission lines for CMOS integrated circuitsMICRON TECHNOLOGY INC·Filed 1999·Granted Apr 16, 2002·116 cites·33 claims
- 1893US6032264AApparatus and method implementing repairs on a memory deviceMICRON TECHNOLOGY INC·Filed 1997·Granted Feb 29, 2000·96 cites·20 claims
- 1993US6002613AData communication for memoryMICRON TECHNOLOGY INC·Filed 1997·Granted Dec 14, 1999·87 cites·30 claims
- 2093US5910921ASelf-test of a memory deviceMICRON TECHNOLOGY INC·Filed 1997·Granted Jun 8, 1999·105 cites·31 claims
- 2193US5724288AData communication for memoryMICRON TECHNOLOGY INC·Filed 1995·Granted Mar 3, 1998·90 cites·43 claims
- 2292US6452415B1Device and method for isolating a short-circuited integrated circuit (IC) from other ICs on a semiconductor waferMICRON TECHNOLOGY INC·Filed 2001·Granted Sep 17, 2002·29 cites·15 claims
- 2392US5155067APackaging for a semiconductor dieMICRON TECHNOLOGY INC·Filed 1991·Granted Oct 13, 1992·106 cites·9 claims
- 2491US7567091B2Method for isolating a short-circuited integrated circuit (IC) from other ICs on a semiconductor waferMICRON TECHNOLOGY INC·Filed 2008·Granted Jul 28, 2009·11 cites·4 claims
- 2591US6525413B1Die to die connection method and assemblies and packages including dice so connectedMICRON TECHNOLOGY INC·Filed 2000·Granted Feb 25, 2003·113 cites·117 claims
- 2691US6313658B1Device and method for isolating a short-circuited integrated circuit (IC) from other IC's on a semiconductor waferMICRON TECHNOLOGY INC·Filed 1998·Granted Nov 6, 2001·48 cites·17 claims
- 2791US6233185B1Wafer level burn-in of memory integrated circuitsMICRON TECHNOLOGY INC·Filed 1999·Granted May 15, 2001·88 cites·28 claims
- 2891US5907512AMask write enablement for memory devices which permits selective masked enablement of plural segmentsMICRON TECHNOLOGY INC·Filed 1993·Granted May 25, 1999·89 cites·15 claims
- 2991US5898186AReduced terminal testing systemMICRON TECHNOLOGY INC·Filed 1996·Granted Apr 27, 1999·71 cites·36 claims
- 3091US5714802AHigh-density electronic moduleMICRON TECHNOLOGY INC·Filed 1994·Granted Feb 3, 1998·124 cites·25 claims
- 3190US6380581B1DRAM technology compatible non volatile memory cells with capacitors connected to the gates of the transistorsMICRON TECHNOLOGY INC·Filed 1999·Granted Apr 30, 2002·84 cites·40 claims
- 3290US6292009B1Reduced terminal testing systemMICRON TECHNOLOGY INC·Filed 1999·Granted Sep 18, 2001·58 cites·11 claims
- 3390US6081463ASemiconductor memory remappingMICRON TECHNOLOGY INC·Filed 1998·Granted Jun 27, 2000·71 cites·18 claims
- 3490US5994915AReduced terminal testing systemMICRON TECHNOLOGY INC·Filed 1997·Granted Nov 30, 1999·68 cites·8 claims
- 3589US7554829B2Transmission lines for CMOS integrated circuitsMICRON TECHNOLOGY INC·Filed 2006·Granted Jun 30, 2009·15 cites·36 claims
- 3689US6622224B1Internal buffered bus for a drumMICRON TECHNOLOGY INC·Filed 1997·Granted Sep 16, 2003·73 cites·95 claims
- 3789US6058056AData compression circuit and method for testing memory devicesMICRON TECHNOLOGY INC·Filed 1998·Granted May 2, 2000·78 cites·14 claims
- 3889US4891794AThree port random access memoryMICRON TECHNOLOGY INC·Filed 1988·Granted Jan 2, 1990·60 cites·20 claims
- 3987US7022553B2Compact system module with built-in thermoelectric coolingMICRON TECHNOLOGY INC·Filed 2003·Granted Apr 4, 2006·35 cites·30 claims
- 4087US6741519B2DRAM technology compatible processor/memory chipsMICRON TECHNOLOGY INC·Filed 2002·Granted May 25, 2004·26 cites·34 claims
- 4186US6906408B2Assemblies and packages including die-to-die connectionsMICRON TECHNOLOGY INC·Filed 2003·Granted Jun 14, 2005·80 cites·46 claims
- 4286US6118138AReduced terminal testing systemMICRON TECHNOLOGY INC·Filed 1997·Granted Sep 12, 2000·46 cites·3 claims
- 4385US6297989B1Applications for non-volatile memory cellsMICRON TECHNOLOGY INC·Filed 1999·Granted Oct 2, 2001·51 cites·40 claims
- 4485US5815427AModular memory circuit and method for forming sameMICRON TECHNOLOGY INC·Filed 1997·Granted Sep 29, 1998·91 cites·49 claims
- 4585US5146308ASemiconductor package utilizing edge connected semiconductor diceMICRON TECHNOLOGY INC·Filed 1990·Granted Sep 8, 1992·88 cites·15 claims
- 4684US7276926B2Method for isolating a short-circuited integrated circuit (IC) from other ICs on a semiconductor waferMICRON TECHNOLOGY INC·Filed 2006·Granted Oct 2, 2007·6 cites·20 claims
- 4783US6831475B2Device and method for isolating a short-circuited integrated circuit (IC) from other ICs on a semiconductor waferMICRON TECHNOLOGY INC·Filed 2003·Granted Dec 14, 2004·14 cites·13 claims
- 4883US6119251ASelf-test of a memory deviceMICRON TECHNOLOGY INC·Filed 1998·Granted Sep 12, 2000·50 cites·68 claims
- 4982US6809985B2DRAM technology compatible processor/memory chipsMICRON TECHNOLOGY INC·Filed 2002·Granted Oct 26, 2004·19 cites·48 claims
- 5082US6145092AApparatus and method implementing repairs on a memory deviceMICRON TECHNOLOGY INC·Filed 1999·Granted Nov 7, 2000·39 cites·36 claims
Showing the top 50 of 94 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →