Inventor · disambiguated record
Eun Hye Do
Also filed as: DO EUN HYE
9 granted patents·5 pending applications·37 citations·filing 2007–2023
81Inventor score
Top patents by PatentIndex Score
14 records- 0192US8564141B2Chip unit and stack package having the sameLEE KYU WON·Filed 2011·Granted Oct 22, 2013·32 cites·16 claims
- 0282US11664351B2Semiconductor package including stacked semiconductor chipsSK HYNIX INC·Filed 2021·Granted May 30, 2023·1 cites·20 claims
- 0368US11996392B2Semiconductor package including stacked semiconductor chipsSK HYNIX INC·Filed 2023·Granted May 28, 2024·0 cites·11 claims
- 0464US10903189B2Stack packages including stacked semiconductor diesSK HYNIX INC·Filed 2018·Granted Jan 26, 2021·1 cites·11 claims
- 0563US9082634B2Stack package and method for manufacturing the sameSHIN HEE-MIN·Filed 2010·Granted Jul 14, 2015·2 cites·11 claims
- 0659US7859108B2Flip chip package and method for manufacturing the sameHYNIX SEMICONDUCTOR INC·Filed 2007·Granted Dec 28, 2010·1 cites·19 claims
- 0756US2024339436A1Stack packagesSK HYNIX INC·Filed 2023·Application pending·0 cites
- 0856US2024258201A1Semiconductor device with through vias of various shapes and method of manufacturing the sameSK HYNIX INC·Filed 2023·Application pending·0 cites
- 0948US2013256887A1Stacked semiconductor package and method for manufacturing the sameSK HYNIX INC·Filed 2013·Application pending·0 cites
- 1047US2010092718A1Wafer mount tape, wafer processing apparatus and method of using the same for use in thinning wafersSHIN HEE MIN·Filed 2008·Application pending·0 cites
- 1146US9305912B2Stack package and method for manufacturing the sameSK HYNIX INC·Filed 2015·Granted Apr 5, 2016·0 cites·6 claims
- 1245US9679865B2Substrate for semiconductor package and semiconductor package having the sameSK HYNIX INC·Filed 2014·Granted Jun 13, 2017·0 cites·9 claims
- 1345US2011189928A1Wafer mount tape, wafer processing apparatus and method of using the same for use in thinning wafersHYNIX SEMICONDUCTOR INC·Filed 2011·Application pending·0 cites
- 1444US8476751B2Stacked semiconductor package and method for manufacturing the sameLEE KYU WON·Filed 2011·Granted Jul 2, 2013·0 cites·13 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →