Inventor · disambiguated record
Eun Jung Jo
Also filed as: JO EUN JUNG
19 granted patents·13 pending applications·154 citations·filing 2011–2021
92Inventor score
Files withSAMSUNG ELECTRO MECH24GWANGJU INST SCIENCE & TECH3SAMSUNG ELECTRONICS CO LTD2GIST GWANGJU INSTITUTE OF SCIENCE AND TECH1JO EUN JUNG1
Top patents by PatentIndex Score
32 records- 0196US10325891B1Fan-out semiconductor package and package on package including the sameSAMSUNG ELECTRO MECH·Filed 2018·Granted Jun 18, 2019·18 cites·20 claims
- 0292US8921955B1Semiconductor device with micro electromechanical system dieLEE JAE UNG·Filed 2011·Granted Dec 30, 2014·22 cites·20 claims
- 0390USD717254SSemiconductor deviceSAMSUNG ELECTRO MECH·Filed 2013·Granted Nov 11, 2014·50 cites·1 claims
- 0489USD717253SSemiconductor deviceSAMSUNG ELECTRO MECH·Filed 2013·Granted Nov 11, 2014·44 cites·1 claims
- 0585US10157886B2Fan-out semiconductor packageSAMSUNG ELECTRO MECH·Filed 2017·Granted Dec 18, 2018·4 cites·15 claims
- 0683US9995741B2Complex for detecting target material and method of detecting target material using the sameGWANGJU INST SCIENCE & TECH·Filed 2016·Granted Jun 12, 2018·2 cites·15 claims
- 0779US10483197B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Nov 19, 2019·4 cites·17 claims
- 0877US10304807B2Fan-out semiconductor packageSAMSUNG ELECTRO MECH·Filed 2018·Granted May 28, 2019·2 cites·20 claims
- 0973US10096552B2Fan-out semiconductor packageSAMSUNG ELECTRO MECH·Filed 2017·Granted Oct 9, 2018·2 cites·20 claims
- 1072US9318828B2Contact pin and power module package having the sameSAMSUNG ELECTRO MECH·Filed 2013·Granted Apr 19, 2016·3 cites·12 claims
- 1167US9585260B2Electronic component module and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2014·Granted Feb 28, 2017·2 cites·6 claims
- 1262US9105616B2External connection terminal, semiconductor package having external connection terminal, and methods for manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2013·Granted Aug 11, 2015·1 cites·20 claims
- 1360US11650203B2One-pot biosensor and immunoassay method using the sameGIST GWANGJU INSTITUTE OF SCIENCE AND TECH·Filed 2021·Granted May 16, 2023·0 cites·19 claims
- 1460US9894790B2Electronic component module and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2014·Granted Feb 13, 2018·0 cites·20 claims
- 1559US10667419B2Manufacturing method of an electronic component moduleSAMSUNG ELECTRO MECH·Filed 2017·Granted May 26, 2020·0 cites·15 claims
- 1650US10871496B2Composite compound comprising upconverting nanoparticle and specific receptorGWANGJU INST SCIENCE & TECH·Filed 2015·Granted Dec 22, 2020·0 cites·9 claims
- 1746US9508565B2Semiconductor package and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2015·Granted Nov 29, 2016·0 cites·12 claims
- 1845US2015153378A1Micro electro mechanical systems sensor module package and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2014·Application pending·0 cites
- 1944US10580759B2Fan-out semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Mar 3, 2020·0 cites·24 claims
- 2044US2015131231A1Electronic component module and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2014·Application pending·0 cites
- 2144US2015091152A1External connection terminal, semiconductor package having external connection terminal and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2014·Application pending·0 cites
- 2244US2015181708A1Semiconductor package moduleSAMSUNG ELECTRO MECH·Filed 2014·Application pending·0 cites
- 2343US2014160691A1Semiconductor module and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2013·Application pending·0 cites
- 2442US2014116670A1Heat sink and cooling system including the sameSAMSUNG ELECTRO MECH·Filed 2013·Application pending·0 cites
- 2542US2015163913A1Nested module package, and method for manufacturing sameSAMSUNG ELECTRO MECH·Filed 2013·Application pending·0 cites
- 2641US2013001759A1Semiconductor package and method of manufacturing the semiconductor packageSAMSUNG ELECTRO MECH·Filed 2012·Application pending·0 cites
- 2741US2014001611A1Semiconductor packageJO EUN JUNG·Filed 2012·Application pending·0 cites
- 2841US2013105956A1Power module package and method for manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2012·Application pending·0 cites
- 2940US10734324B2Fan-out semiconductor package including stacked chipsSAMSUNG ELECTRO MECH·Filed 2018·Granted Aug 4, 2020·0 cites·10 claims
- 3040US2017010249A1Method for detecting cadmium and kit for detecting cadmium using fluorescence intensity according to formation of cadmium nanoclusterGWANGJU INST SCIENCE & TECH·Filed 2016·Application pending·0 cites
- 3138US2019164893A1Semiconductor packageSAMSUNG ELECTRO MECH·Filed 2018·Application pending·0 cites
- 3233US2015228625A1Semiconductor package and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →