Inventor · disambiguated record
Eun Sun Joeng
Also filed as: JOENG EUN SUN
13 granted patents·10 pending applications·2 citations·filing 2019–2023
81Inventor score
Top patents by PatentIndex Score
23 records- 0180US11207757B2Composition for polishing pad, polishing pad and preparation method of semiconductor deviceSKC SOLMICS CO LTD·Filed 2020·Granted Dec 28, 2021·1 cites·20 claims
- 0272US11279825B2Composition for polishing pad, polishing pad and preparation method thereofSKC SOLMICS CO LTD·Filed 2019·Granted Mar 22, 2022·1 cites·13 claims
- 0367US12098242B2Biodegradable polyester resin composition, biodegradable polyester film including the same and biodegradable molded article including biodegradable polyester resin compositionECOVANCE CO LTD·Filed 2023·Granted Sep 24, 2024·0 cites·12 claims
- 0467US2024002656A1Biodegradable polyester resin composition, method of preparing the same and biodegradable molded article including biodegradable polyester resin compositionECOVANCE CO LTD·Filed 2023·Application pending·0 cites
- 0566US2023374294A1Biodegradable polyester resin composition and biodegradable molded article including biodegradable polyester resin compositionECOVANCE CO LTD·Filed 2023·Application pending·0 cites
- 0666US2023374296A1Biodegradable molded article and biodegradable polyester resin composition and biodegradable polyester filmECOVANCE CO LTD·Filed 2023·Application pending·0 cites
- 0766US2023399507A1Biodegradable polyester resin composition, biodegradable polyester film including the same and biodegradable molded article including biodegradable polyester resin compositionECOVANCE CO LTD·Filed 2023·Application pending·0 cites
- 0862US12122013B2Composition for polishing pad and polishing padSK ENPULSE CO LTD·Filed 2020·Granted Oct 22, 2024·0 cites·13 claims
- 0962US2022203496A1Polishing pad, manufacturing method thereof, method for manufacturing semiconductor device using sameSKC SOLMICS CO LTD·Filed 2021·Application pending·0 cites
- 1059US12480021B2Composition for semiconductor process, method for preparing the same and method for preparing semiconductor device using the sameSK ENPULSE CO LTD·Filed 2023·Granted Nov 25, 2025·0 cites·13 claims
- 1158US11534887B2Polishing pad and method for preparing semiconductor device using sameSKC SOLMICS CO LTD·Filed 2021·Granted Dec 27, 2022·0 cites·14 claims
- 1255US11400559B2Polishing pad, process for preparing the same, and process for preparing a semiconductor device using the sameSKC SOLMICS CO LTD·Filed 2020·Granted Aug 2, 2022·0 cites·20 claims
- 1354US11548970B2Composition for a polishing pad, polishing pad, and process for preparing the sameSKC SOLMICS CO LTD·Filed 2019·Granted Jan 10, 2023·0 cites·20 claims
- 1453US12076832B2Polishing pad with improved crosslinking density and process for preparing the sameSKC SOLMICS CO LTD·Filed 2020·Granted Sep 3, 2024·0 cites·10 claims
- 1551US2022355436A1Polishing pad, method for manufacturing the same, and method for manufacturing semiconductor device using the sameSKC SOLMICS CO LTD·Filed 2022·Application pending·0 cites
- 1651US2023047113A1Polishing device and method for manufacturing semiconductor deviceSKC SOLMICS CO LTD·Filed 2022·Application pending·0 cites
- 1749US12486428B2Polishing pad and method for manufacturing semiconductor device using sameSK ENPULSE CO LTD·Filed 2022·Granted Dec 2, 2025·0 cites·13 claims
- 1849US12162114B2Polishing pad, manufacturing method thereof and preparing method of semiconductor device using the sameSK ENPULSE CO LTD·Filed 2021·Granted Dec 10, 2024·0 cites·17 claims
- 1949US2022288743A1Polishing pad, method for producing the same and method of fabricating semiconductor device using the sameSKC SOLMICS CO LTD·Filed 2022·Application pending·0 cites
- 2049US2022097197A1Polishing pad and method of fabricating semiconductor device using the sameSKC SOLMICS CO LTD·Filed 2021·Application pending·0 cites
- 2148US12246408B2Polishing pad and method of fabricating semiconductor device using the sameSK ENPULSE CO LTD·Filed 2021·Granted Mar 11, 2025·0 cites·15 claims
- 2248US2022371155A1Polishing pad, manufacturing method thereof, method for manufacturing semiconductor device using sameSKC SOLMICS CO LTD·Filed 2022·Application pending·0 cites
- 2347US12258460B2Polishing pad and method of fabricating semiconductor device using the sameSK ENPULSE CO LTD·Filed 2021·Granted Mar 25, 2025·0 cites·10 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →