Inventor · disambiguated record
Eunsuk Jung
Also filed as: JUNG EUNSUK
3 granted patents·0 citations·filing 2018–2023
43Inventor score
Top patents by PatentIndex Score
3 records- 0170US12300671B2Semiconductor packages and methods of manufacturing the semiconductor packagesSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted May 13, 2025·0 cites·20 claims
- 0259US11810900B2Semiconductor packages stacked by wafer bonding process and methods of manufacturing the semiconductor packagesSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Nov 7, 2023·0 cites·18 claims
- 0332US10847938B2Antenna cable connecting module and method for producing antenna cable connecting moduleKMW INC·Filed 2018·Granted Nov 24, 2020·0 cites·13 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →