Inventor · disambiguated record
Eunhee Jung
Also filed as: JUNG EUNHEE
8 granted patents·1 pending application·8 citations·filing 2018–2024
79Inventor score
Technology areasH10W
Files withSAMSUNG ELECTRONICS CO LTD9
Top patents by PatentIndex Score
9 records- 0193US12062605B2Semiconductor package including an interposer and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Aug 13, 2024·1 cites·20 claims
- 0282US11367679B2Semiconductor package including an in interposer and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Jun 21, 2022·1 cites·20 claims
- 0377US11125734B2Gas sensor packageSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Sep 21, 2021·3 cites·18 claims
- 0475US11658107B2Semiconductor package including an interposer and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted May 23, 2023·0 cites·15 claims
- 0575US10760930B2Sensor package, method of manufacturing the same, and method of manufacturing lid structureSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Sep 1, 2020·2 cites·11 claims
- 0664US11067554B2Gas sensor package and sensing apparatus including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Jul 20, 2021·1 cites·20 claims
- 0761US11131568B2Sensor package, method of manufacturing the same, and method of manufacturing lid structureSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Sep 28, 2021·0 cites·20 claims
- 0856US2025062304A1Semiconductor package and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0951US10923428B2Semiconductor package having second pad electrically connected through the interposer chip to the first padSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Feb 16, 2021·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →