Inventor · disambiguated record
Eunsil Kang
Also filed as: KANG EUNSIL
1 granted patent·2 pending applications·0 citations·filing 2021–2024
13Inventor score
Technology areasH10W
Files withSAMSUNG ELECTRONICS CO LTD3
Top patents by PatentIndex Score
3 records- 0167US2024222217A1Semiconductor package including high thermal conductivity layerSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0258US11948851B2Semiconductor package including high thermal conductivity layerSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Apr 2, 2024·0 cites·19 claims
- 0345US2025079425A1Semiconductor PackageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →