Inventor · disambiguated record
Eun Dong Kim
Also filed as: KIM EUN DONG
6 granted patents·2 pending applications·62 citations·filing 2012–2016
81Inventor score
Top patents by PatentIndex Score
8 records- 0192US9466586B1Method for manufacturing wafer-level fan-out packageSTS SC & TELECOMM CO LTD·Filed 2015·Granted Oct 11, 2016·35 cites·6 claims
- 0289US9935072B2Semiconductor package and method for manufacturing the sameSFA SEMICON CO LTD·Filed 2016·Granted Apr 3, 2018·11 cites·13 claims
- 0389US9905436B2Wafer level fan-out package and method for manufacturing the sameSTS SC & TELECOMM CO LTD·Filed 2016·Granted Feb 27, 2018·10 cites·3 claims
- 0480US9905551B2Method of manufacturing wafer level packaging including through encapsulation viasSTS SC & TELECOMM CO LTD·Filed 2015·Granted Feb 27, 2018·4 cites·19 claims
- 0568US10103117B2Method of manufacturing fan-out type wafer level packageSFA SEMICON CO LTD·Filed 2016·Granted Oct 16, 2018·2 cites·3 claims
- 0642US10050499B2Method of manufacturing voice coilSTS SC & TELECOMM CO LTD·Filed 2015·Granted Aug 14, 2018·0 cites·10 claims
- 0738US2014301567A1Method for providing a compensation service for characteristics of an audio device using a smart deviceKIM EUN DONG·Filed 2012·Application pending·0 cites
- 0832US2016365195A1Method for manufacturing voice coilSTS SC & TELECOMM CO LTD·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →