Inventor · disambiguated record
Eung Jae Kim
Also filed as: KIM EUNG JAE
1 granted patent·4 pending applications·0 citations·filing 2014–2016
11Inventor score
Files withMK ELECTRON CO LTD5
Top patents by PatentIndex Score
5 records- 0154US9391039B2Solder balls and semiconductor device employing the sameMK ELECTRON CO LTD·Filed 2014·Granted Jul 12, 2016·0 cites·11 claims
- 0240US2015064293A1Metal ball fabricating apparatusMK ELECTRON CO LTD·Filed 2014·Application pending·0 cites
- 0335US2016244891A1Solder ball for fluxless bonding, method of manufacturing the same, and method of forming solder bumpMK ELECTRON CO LTD·Filed 2016·Application pending·0 cites
- 0426US2016315040A1Core for reverse reflow, semiconductor package, and method of fabricating semiconductor packageMK ELECTRON CO LTD·Filed 2016·Application pending·0 cites
- 0526US2016256962A1Lead-free solder having low melting pointMK ELECTRON CO LTD·Filed 2016·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →