Inventor · disambiguated record
Eunseok Lee
Also filed as: LEE EUNSEOK
7 granted patents·5 pending applications·11 citations·filing 2008–2025
76Inventor score
Top patents by PatentIndex Score
12 records- 0182US12191497B2Metal halide cathode with enriched conductive additiveIBM·Filed 2023·Granted Jan 7, 2025·0 cites·12 claims
- 0280US11824199B2Metal halide cathode with enriched conductive additiveIBM·Filed 2020·Granted Nov 21, 2023·1 cites·30 claims
- 0377US12345773B2System for estimating the state of health (SOH) of battery, system and method for deriving parameters thereforHEI·Filed 2023·Granted Jul 1, 2025·1 cites·14 claims
- 0469US2025100018A1Chemical mechanical polishing deviceSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0564US2025327876A1System for estimating the state of health of battery, system and method for deriving parameters thereforHEI·Filed 2025·Application pending·0 cites
- 0664US2025196166A1Nozzle module, substrate cleaning device and, substrate cleaning method using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0762US8103555B2User recommendation method and recorded medium storing program for implementing the methodLEE EUNSEOK·Filed 2008·Granted Jan 24, 2012·5 cites·8 claims
- 0859US12456633B2Wafer cleaning equipmentSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Oct 28, 2025·0 cites·20 claims
- 0956US12354660B2Semiconductor devicesWUHAN XINXIN SEMICONDUCTOR MFG·Filed 2023·Granted Jul 8, 2025·0 cites·20 claims
- 1055US8639687B2User-customized content providing device, method and recorded mediumLEE SEUNGHWA·Filed 2008·Granted Jan 28, 2014·4 cites·17 claims
- 1139US2009012937A1Apparatus, method and recorded medium for collecting user preference information by using tag informationUNIV SUNGKYUNKWAN FOUND·Filed 2008·Application pending·0 cites
- 1237US2016023323A1Carrier head and chemical mechanical polishing apparatusSAMSUNG ELECTRONICS CO LTD·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →