Inventor · disambiguated record
Euibok Lee
Also filed as: LEE EUIBOK
6 granted patents·2 pending applications·1 citations·filing 2014–2024
66Inventor score
Files withSAMSUNG ELECTRONICS CO LTD8
Top patents by PatentIndex Score
8 records- 0181US12451421B2Semiconductor device with double etch stop layer and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Oct 21, 2025·1 cites·17 claims
- 0271US2024234312A1Integrated circuit device and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0369US2024297072A1Semi-damascene structure with dielectric hardmask layerSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0464US12444675B2Semiconductor devicesSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Oct 14, 2025·0 cites·20 claims
- 0562US12021027B2Integrated circuit device having parallel conductive lines with bulging end portion(s) and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jun 25, 2024·0 cites·19 claims
- 0662US12014951B2Semi-damascene structure with dielectric hardmask layerSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jun 18, 2024·0 cites·11 claims
- 0747US11488864B2Self-aligned supervia and metal direct etching process to manufacture self-aligned superviaSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Nov 1, 2022·0 cites·16 claims
- 0844US9171755B2Methods of manufacturing semiconductor devices including capped metal patterns with air gaps in-between for parasitic capacitance reductionSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Oct 27, 2015·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →