Inventor · disambiguated record
Eui Bok Lee
Also filed as: LEE EUI BOK
19 granted patents·9 pending applications·46 citations·filing 2017–2024
91Inventor score
Files withSAMSUNG ELECTRONICS CO LTD28
Top patents by PatentIndex Score
28 records- 0195US10403729B2Semiconductor devices and contact plugsSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Sep 3, 2019·17 cites·13 claims
- 0294US10461027B2Semiconductor device including via plug and method of forming the sameSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Oct 29, 2019·10 cites·20 claims
- 0392US10475739B2Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Nov 12, 2019·8 cites·20 claims
- 0486US10276505B2Integrated circuit device and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Apr 30, 2019·5 cites·20 claims
- 0582US11664310B2Semiconductor device and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted May 30, 2023·1 cites·20 claims
- 0674US10535600B2Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Jan 14, 2020·2 cites·19 claims
- 0772US10847454B2Semiconductor devicesSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Nov 24, 2020·1 cites·20 claims
- 0871US10741657B2Semiconductor devices and contact plugsSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Aug 11, 2020·1 cites·20 claims
- 0970US10510658B2Semiconductor devicesSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Dec 17, 2019·1 cites·20 claims
- 1069US12199038B2Semiconductor devices and methods of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Jan 14, 2025·0 cites·20 claims
- 1168US12218046B2Semiconductor device and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Feb 4, 2025·0 cites·20 claims
- 1263US11728268B2Semiconductor devices including via structures having a via portion and a barrier portionSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Aug 15, 2023·0 cites·20 claims
- 1362US2025063814A1Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1460US12451422B2Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Oct 21, 2025·0 cites·20 claims
- 1560US2025118669A1Semiconductor devicesSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1660US2025006641A1Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1760US2025285978A1Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1859US12046556B2Semiconductor devices having highly integrated active and power distribution regions thereinSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jul 23, 2024·0 cites·20 claims
- 1958US2024421090A1Semiconductor device and method for fabricating thereofSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 2058US2024222453A1Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 2157US12456650B2Semiconductor device and method for manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Oct 28, 2025·0 cites·20 claims
- 2257US2024222450A1Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 2356US2025316582A1Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 2454US12354943B2Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jul 8, 2025·0 cites·19 claims
- 2554US12243815B2Semiconductor device and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Mar 4, 2025·0 cites·20 claims
- 2653US2019304903A1Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2019·Application pending·0 cites
- 2744US12387980B2Semiconductor device and method for fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Aug 12, 2025·0 cites·16 claims
- 2843US10916437B2Methods of forming micropatterns and substrate processing apparatusSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Feb 9, 2021·0 cites·19 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →