Inventor · disambiguated record
Eunkyeong Park
Also filed as: PARK EUNKYEONG
0 granted patents·7 pending applications·0 citations·filing 2024–2024
Technology areasH10W
Files withSAMSUNG ELECTRONICS CO LTD7
Top patents by PatentIndex Score
7 records- 0154US2025259921A1Package substrate and semiconductor package including the package substrateSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0254US2025201776A1Semiconductor package and method for manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0353US2025149458A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0453US2025118672A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0552US2025193997A1Multilayer wiring substrate and semiconductor package including the multilayer wiring substrateSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0652US2025096099A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0746US2025183163A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →