Inventor · disambiguated record
Eunseok Song
Also filed as: SONG EUNSEOK
26 granted patents·7 pending applications·186 citations·filing 2001–2025
94Inventor score
Top patents by PatentIndex Score
33 records- 0198US11862618B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jan 2, 2024·9 cites·19 claims
- 0292US6553089B2Fractional-N frequency synthesizer with fractional compensation methodGCT SEMICONDUCTOR INC·Filed 2001·Granted Apr 22, 2003·59 cites·46 claims
- 0391US11984421B2Integrated circuit chip having BS-PDN structureSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted May 14, 2024·3 cites·20 claims
- 0489US11631660B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Apr 18, 2023·2 cites·18 claims
- 0587US6704383B2Sample and hold type fractional-N frequency synthesizerGCT SEMICONDUCTOR INC·Filed 2001·Granted Mar 9, 2004·38 cites·33 claims
- 0683US8350158B2Tape wiring substrates and packages including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2009·Granted Jan 8, 2013·11 cites·13 claims
- 0782US6850748B2RF front end with reduced carrier leakageGCT SEMICONDUCTOR INC·Filed 2002·Granted Feb 1, 2005·25 cites·33 claims
- 0881US12308363B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted May 20, 2025·0 cites·19 claims
- 0980US12237308B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Feb 25, 2025·0 cites·20 claims
- 1080US6952125B2System and method for suppressing noise in a phase-locked loop circuitGCT SEMICONDUCTOR INC·Filed 2003·Granted Oct 4, 2005·27 cites·40 claims
- 1179US11482516B2Semiconductor package and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Oct 25, 2022·1 cites·16 claims
- 1278US2025266415A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 1376US2025054917A1Semiconductor package and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1473US2025364491A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 1571US11996398B2Semiconductor package and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted May 28, 2024·0 cites·20 claims
- 1670US12489083B23D laminated chip, and semiconductor package including the 3D laminated chipSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Dec 2, 2025·0 cites·17 claims
- 1770US12040304B2Semiconductor package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Jul 16, 2024·0 cites·20 claims
- 1870US11837577B2System-in-package moduleSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Dec 5, 2023·0 cites·20 claims
- 1969US11901336B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Feb 13, 2024·0 cites·20 claims
- 2068US2024318299A1Deposition source and apparatus for manufacturing display apparatusSAMSUNG DISPLAY CO LTD·Filed 2024·Application pending·0 cites
- 2165US12211829B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Jan 28, 2025·0 cites·20 claims
- 2265US11532591B2Semiconductor package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Dec 20, 2022·0 cites·20 claims
- 2362US12166010B2Semiconductor package and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Dec 10, 2024·0 cites·14 claims
- 2462US6963620B2Communication transmitter using offset phase-locked-loopGCT SEMICONDUCTOR INC·Filed 2002·Granted Nov 8, 2005·8 cites·7 claims
- 2560US11398454B2System-in-package moduleSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Jul 26, 2022·0 cites·15 claims
- 2660US2024213143A1Semiconductor packages having capacitorsSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 2758US2024071943A1Semiconductor packagesSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 2855US7812672B2Low noise amplifier having improved linearityGCT SEMICONDUCTOR INC·Filed 2007·Granted Oct 12, 2010·3 cites·14 claims
- 2953US12057441B2Semiconductor package including a plurality of semiconductor chipsSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Aug 6, 2024·0 cites·20 claims
- 3053US2022415775A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2022·Application pending·0 cites
- 3150US11887965B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jan 30, 2024·0 cites·16 claims
- 3245US10284183B2Slew rate enhancement circuit and buffer using the sameACONIC INC·Filed 2018·Granted May 7, 2019·0 cites·15 claims
- 3336US7535977B2Sigma-delta based phase lock loopGCT SEMICONDUCTOR INC·Filed 2005·Granted May 19, 2009·0 cites·25 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →