Inventor · disambiguated record
Evelyn Napetschnig
Also filed as: NAPETSCHNIG EVELYN
24 granted patents·9 pending applications·12 citations·filing 2010–2025
92Inventor score
Files withINFINEON TECHNOLOGIES AG27INFINEON TECHNOLOGIES AUSTRIA AG2HARRISON MARK1MAYER KARL1MENGEL MANFRED1
Top patents by PatentIndex Score
33 records- 0180US12040288B2Chip package and method of forming a chip packageINFINEON TECHNOLOGIES AG·Filed 2023·Granted Jul 16, 2024·0 cites·20 claims
- 0277US2024371796A1Chip package and method of forming a chip packageINFINEON TECHNOLOGIES AG·Filed 2024·Application pending·0 cites
- 0376US8487440B2Backside processing of semiconductor devicesHARRISON MARK·Filed 2010·Granted Jul 16, 2013·4 cites·49 claims
- 0474US2025157857A1Component and method of manufacturing a component using an ultrathin carrierINFINEON TECHNOLOGIES AG·Filed 2025·Application pending·0 cites
- 0572US12183696B2Semiconductor device including bonding pad metal layer structureINFINEON TECHNOLOGIES AG·Filed 2023·Granted Dec 31, 2024·0 cites·25 claims
- 0672US11367654B2Component and method of manufacturing a component using an ultrathin carrierINFINEON TECHNOLOGIES AG·Filed 2019·Granted Jun 21, 2022·1 cites·15 claims
- 0771US11735534B2Chip package and method of forming a chip packageINFINEON TECHNOLOGIES AG·Filed 2021·Granted Aug 22, 2023·0 cites·20 claims
- 0871US10115688B2Solder metallization stack and methods of formation thereofINFINEON TECHNOLOGIES AG·Filed 2015·Granted Oct 30, 2018·2 cites·18 claims
- 0970US2022246475A1Component and Method of Manufacturing a Component Using an Ultrathin CarrierINFINEON TECHNOLOGIES AG·Filed 2022·Application pending·0 cites
- 1068US9484316B2Semiconductor devices and methods of forming thereofINFINEON TECHNOLOGIES AG·Filed 2013·Granted Nov 1, 2016·2 cites·25 claims
- 1167US10741402B2Electronic device, electronic module and methods for fabricating the sameINFINEON TECHNOLOGIES AG·Filed 2017·Granted Aug 11, 2020·1 cites·13 claims
- 1267US10262959B2Semiconductor devices and methods of forming thereofINFINEON TECHNOLOGIES AG·Filed 2016·Granted Apr 16, 2019·1 cites·25 claims
- 1365US11776927B2Semiconductor device including a solder compound containing a compound Sn/SbINFINEON TECHNOLOGIES AG·Filed 2021·Granted Oct 3, 2023·0 cites·20 claims
- 1463US11764176B2Semiconductor device including bonding pad metal layer structureINFINEON TECHNOLOGIES AG·Filed 2021·Granted Sep 19, 2023·0 cites·18 claims
- 1563US11615963B2Electronic device, electronic module and methods for fabricating the sameINFINEON TECHNOLOGIES AG·Filed 2020·Granted Mar 28, 2023·0 cites·20 claims
- 1661US10186458B2Component and method of manufacturing a component using an ultrathin carrierMAYER KARL·Filed 2012·Granted Jan 22, 2019·1 cites·18 claims
- 1761US2024347369A1Dissolving adhesive base structure to release electronic componentINFINEON TECHNOLOGIES AG·Filed 2024·Application pending·0 cites
- 1861US2021167034A1Chip arrangementsINFINEON TECHNOLOGIES AG·Filed 2021·Application pending·0 cites
- 1956US11069644B2Semiconductor device including a solder compound containing a compound Sn/SbINFINEON TECHNOLOGIES AG·Filed 2019·Granted Jul 20, 2021·0 cites·16 claims
- 2054US10573611B2Solder metallization stack and methods of formation thereofINFINEON TECHNOLOGIES AG·Filed 2018·Granted Feb 25, 2020·0 cites·20 claims
- 2153US10930614B2Chip arrangementsINFINEON TECHNOLOGIES AG·Filed 2017·Granted Feb 23, 2021·0 cites·16 claims
- 2252US8866299B2Backside processing of semiconductor devicesINFINEON TECHNOLOGIES AG·Filed 2013·Granted Oct 21, 2014·0 cites·20 claims
- 2352US2024030502A1Semiconductor device, battery management system and method of producing a semiconductor deviceINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2023·Application pending·0 cites
- 2451US11501979B1Semiconductor device and method of producing a semiconductor deviceINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2021·Granted Nov 15, 2022·0 cites·20 claims
- 2551US11410950B2Semiconductor substrate having a bond pad material based on aluminumINFINEON TECHNOLOGIES AG·Filed 2020·Granted Aug 9, 2022·0 cites·18 claims
- 2649US11424201B2Method of forming an aluminum oxide layer, metal surface with aluminum oxide layer, and electronic deviceINFINEON TECHNOLOGIES AG·Filed 2018·Granted Aug 23, 2022·0 cites·13 claims
- 2748US9735126B2Solder alloys and arrangementsMENGEL MANFRED·Filed 2011·Granted Aug 15, 2017·0 cites·25 claims
- 2842US2015228607A1Layer stacks and integrated circuit arrangementsINFINEON TECHNOLOGIES AG·Filed 2015·Application pending·0 cites
- 2942US2012068345A1Layer stacks and integrated circuit arrangementsSCHMIDT TOBIAS·Filed 2010·Application pending·0 cites
- 3039US9627335B2Method for processing a semiconductor workpiece and semiconductor workpieceINFINEON TECHNOLOGIES AG·Filed 2014·Granted Apr 18, 2017·0 cites·17 claims
- 3136US10914018B2Porous Cu on Cu surface for semiconductor packagesINFINEON TECHNOLOGIES AG·Filed 2019·Granted Feb 9, 2021·0 cites·28 claims
- 3236US2020043876A1Adhesion Enhancing Structures for a PackageINFINEON TECHNOLOGIES AG·Filed 2019·Application pending·0 cites
- 3335US10276362B2Method for processing a semiconductor region and an electronic deviceINFINEON TECHNOLOGIES AG·Filed 2016·Granted Apr 30, 2019·0 cites·19 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →