Inventor · disambiguated record
Farhad Farassat
Also filed as: FARASSAT FARHAD
22 granted patents·2 pending applications·465 citations·filing 1986–2010
96Inventor score
Files withF&K DELVOTEC BONDTECHNIK GMBH10F & K DELVOTEC BONDTECH GMBH6EMHART DEUTSCHLAND2DYNAPERT DELVOTEC SA1DYNAPERT INC1
Top patents by PatentIndex Score
24 records- 0188US4925083ABall bonding method and apparatus for performing the methodEMHART DEUTSCHLAND·Filed 1987·Granted May 15, 1990·139 cites·5 claims
- 0280US7735711B2Method of testing bonded connections, and a wire bonderF & K DELVOTEC BONDTECH GMBH·Filed 2007·Granted Jun 15, 2010·8 cites·11 claims
- 0374US5314105AWire bonding ultrasonic control system responsive to wire deformationF&K DELVOTEC BONDTECHNIK GMBH·Filed 1992·Granted May 24, 1994·51 cites·6 claims
- 0473US7458496B2Wire bonder and method of operating the sameF & K DELVOTEC BONDTECH GMBH·Filed 2005·Granted Dec 2, 2008·6 cites·6 claims
- 0573US6758385B2Apparatus for performing a pull testF & K DELVOTEC BONDTECH GMBH·Filed 2002·Granted Jul 6, 2004·16 cites·28 claims
- 0671US6891730B2Circuit housingF&K DELVOTEC BONDTECHNIK GMBH·Filed 2001·Granted May 10, 2005·18 cites·25 claims
- 0769US6827248B2Cutting device for bonded wiresF&K DELVOTEC BONDTECHNIK GMBH·Filed 2002·Granted Dec 7, 2004·16 cites·22 claims
- 0865US4781319ABonding headDYNAPERT DELVOTEC SA·Filed 1986·Granted Nov 1, 1988·43 cites·13 claims
- 0964US4928871AApparatus and method of controlled feed of a bonding wire to the "wedge" of a bonding headEMHART DEUTSCHLAND·Filed 1989·Granted May 29, 1990·29 cites·14 claims
- 1062US6905058B2Bonding tool and wire bonderF & K DELVOTEC BONDTECH GMBH·Filed 2003·Granted Jun 14, 2005·10 cites·19 claims
- 1156US5018658ABonding wedgeDYNAPERT INC·Filed 1990·Granted May 28, 1991·25 cites·4 claims
- 1253US7156602B2Mechanism for exchanging chip-carrier plates for use in a hybrid chip-bonding machineF & K DELVOTEC BONDTECHNICK GM·Filed 2002·Granted Jan 2, 2007·6 cites·30 claims
- 1352US6745629B2Method and apparatus for the production and quality testing of a bonded wire connectionF & K DELVOTEC BONDTECH GMBH·Filed 2002·Granted Jun 8, 2004·4 cites·27 claims
- 1451US5452838ABonding head for an ultrasonic bonding machineF&K DELVOTEC BONDTECHNIK GMBH·Filed 1993·Granted Sep 26, 1995·19 cites·8 claims
- 1550US5906706AWire guide for a bonding machineF&K DELVOTEC BONDTECHNIK GMBH·Filed 1997·Granted May 25, 1999·16 cites·8 claims
- 1645US6912906B2Method and apparatus for the production and quality testing of a bonded wire connectionF & K DELVOTEC BONDTECH GMBH·Filed 2004·Granted Jul 5, 2005·1 cites·18 claims
- 1745US5979737AUltrasonic bonding head comprising a linear motor for adjusting the pressure according to a piezo detectorF&K DELVOTEC BONDTECHNIK GMBH·Filed 1997·Granted Nov 9, 1999·12 cites·10 claims
- 1844US6786320B2Chip-transferring station for a bonding machineF&K DELVOTEC BONDTECHNIK GMBH·Filed 2003·Granted Sep 7, 2004·1 cites·10 claims
- 1943US5277354ADevice for monitoring wire supply and consumptionF&K DELVOTEC BONDTECHNIK GMBH·Filed 1992·Granted Jan 11, 1994·13 cites·3 claims
- 2043US4878609AApparatus for manual wire bondingEMHART IND·Filed 1987·Granted Nov 7, 1989·12 cites·9 claims
- 2142US5950903ABonding headF&K DELVOTEC BONDTECHNIK GMBH·Filed 1997·Granted Sep 14, 1999·10 cites·9 claims
- 2240US5170928ABonding headEMHART INC·Filed 1991·Granted Dec 15, 1992·10 cites·3 claims
- 2338US2003085255A1Method of testing bonded connections, and a wire bonderFARASSAT FARHAD·Filed 2002·Application pending·0 cites
- 2437US2011259939A1Transducer of an ultrasonic bonderF&K DELVOTEC BONDTECHNIK GMBH·Filed 2010·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →