Inventor · disambiguated record
Fangyuan Hong
Also filed as: HONG FANGYUAN
1 granted patent·2 pending applications·0 citations·filing 2016–2016
5Inventor score
Files withCHINA WAFER LEVEL CSP CO LTD3
Top patents by PatentIndex Score
3 records- 0129US10490583B2Packaging structure and packaging methodCHINA WAFER LEVEL CSP CO LTD·Filed 2016·Granted Nov 26, 2019·0 cites·13 claims
- 0228US2018240827A1Package structure and packaging methodCHINA WAFER LEVEL CSP CO LTD·Filed 2016·Application pending·0 cites
- 0326US2018337206A1Package structure and packaging methodCHINA WAFER LEVEL CSP CO LTD·Filed 2016·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →