Inventor · disambiguated record
Fang-Yu Liang
Also filed as: LIANG FANG-YU
13 granted patents·1 pending application·58 citations·filing 2015–2023
87Inventor score
Top patents by PatentIndex Score
14 records- 0196US10062651B2Packaging substrate and electronic package having the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2016·Granted Aug 28, 2018·48 cites·20 claims
- 0287US10629539B2Package structure and method of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Apr 21, 2020·4 cites·19 claims
- 0381US10199341B2Substrate structureSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2016·Granted Feb 5, 2019·4 cites·10 claims
- 0477US12148692B2Semiconductor package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Nov 19, 2024·0 cites·20 claims
- 0573US11973038B2Package structure with improved antenna patterns performanceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Apr 30, 2024·0 cites·20 claims
- 0672US11682619B2Package component, semiconductor package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jun 20, 2023·0 cites·20 claims
- 0772US10049975B2Substrate structureSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2016·Granted Aug 14, 2018·2 cites·7 claims
- 0869US11094642B2Package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Aug 17, 2021·0 cites·20 claims
- 0966US11309242B2Package component, semiconductor package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Apr 19, 2022·0 cites·20 claims
- 1065US11233019B2Manufacturing method of semicondcutor packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jan 25, 2022·0 cites·20 claims
- 1155US10720399B2Semicondcutor package and manufacturing method of semicondcutor packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jul 21, 2020·0 cites·20 claims
- 1250US11374303B2Package structure and method of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jun 28, 2022·0 cites·20 claims
- 1349US11515274B2Semiconductor package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Nov 29, 2022·0 cites·20 claims
- 1433US2017053859A1Electronic package and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →